Fine grinding & polishing · Flat-parts branch
VIMFUN® DL-290 / DL-395 · DOUBLE-SIDED PLANETARY

Wafer Lapping and Polishing Machine DL-290 / DL-395

A wafer lapping and polishing machine that works both faces of a flat part at once. Parts ride in planetary carriers between two plates, so silicon, sapphire, ceramic and glass come out flat and parallel — up to Ø290 mm on the DL-290, Ø395 mm on the DL-395.

2
Faces at once
Ø290/395 mm
Max workpiece
0.3–30 mm
Thickness
5 / 6
Star wheels
Vimfun DL double-sided wafer lapping and polishing machine with upper and lower plates and planetary star-wheel carriers
Vimfun® DL-290 / DL-395 — double-sided planetary lapping and polishing, gantry frame, four-post upper-plate lift.
Where it sits

What this machine does, and where flat parts go

Curved lenses are finished one face at a time on a swinging spindle. Flat parts — wafers, substrates, windows, crystal blanks — are finished differently: both faces together, between two large plates, so the part comes out flat, parallel and the same thickness across its width. A wafer lapping and polishing machine owns that job, and it is the flat-parts counterpart to the lens polishers on the curved side of the line.

01
Sawing / slicing
Blank or wafer cut
02
Lapping
This machine
03
Polishing
This machine
04
Cleaning
Post-process
05
Inspection
Thickness, flatness

The same platform laps with a fixed abrasive or slurry, then polishes with a pad and compound. For measuring the parts it produces, the thickness sorting machine gauges flat parts to the micron; for curved optics, the lens polishers are the right machines instead.

Two sizes, one platform

The DL-290 carries six star wheels and takes parts up to Ø290 mm; the DL-395 carries five and takes parts up to Ø395 mm at higher plate pressure. Both share the planetary double-sided design — pick the size by your largest part and your batch.

How does a wafer lapping and polishing machine keep a part flat?

By moving every part along a planetary path between two plates, so no point on the wafer sees more wear than any other.

ring gear (outer) sun star wheel looping path both faces, even removal between upper and lower plates
Star-wheel carriers roll between a sun gear and a ring gear, so each part traces a looping path.

The parts sit in the openings of star-wheel carriers. Those carriers mesh with a central sun gear and an outer ring gear, so as the plates turn, each carrier both spins and orbits — every part traces a looping path rather than a single circle. That is what averages out the wear and leaves the wafer flat.

What the operator controls:

  • Three drives, independent — upper plate, lower plate and the gears run on variable-frequency drives, each with its own speed and direction
  • Proportional-valve pressure — plate load is set electrically, up to 400 kg on the DL-290 and 700 kg on the DL-395
  • Recipes — eight parameter sets and ten recipes hold the settings for a job so they repeat batch to batch
  • Central lubrication — the moving gears are oiled automatically from one point

Because a wafer lapping and polishing machine works both faces between two plates at once, a whole carrier of parts comes out to the same thickness in one run, rather than one face and one part at a time.

What this means when you buy

You are buying a platform and the plates, carriers and abrasive for your parts — not a fixed recipe. Send us the material, the diameter, the thickness and the flatness you have to hold, and we specify the tooling with the quotation.

Four things that decide the result

Loading and unloading the carriers are by hand; the lapping and polishing runs under the drives once the plates close. These are what a wafer lapping and polishing machine gets right.

1

Both faces, a whole carrier at once

Every part in the carriers is worked top and bottom together, so a batch comes out flat, parallel and to one thickness in a single run.

2

Three drives set the motion

Upper plate, lower plate and the gear train each run on their own variable-frequency drive, with independent speed and reversal, so the planetary motion is tuned to the material.

3

Pressure set by proportional valve

Plate load is controlled electrically through a proportional valve rather than by dead weights, so the down-force a thin or brittle wafer needs is dialled in and held.

4

Recipes and auto lubrication

Eight parameter sets and ten recipes store the settings for recurring jobs, and central lubrication keeps the gear train fed without a manual round.

Capability

Which materials can it lap and polish?

ItemCapability
Part shapeFlat parts — wafers, substrates, windows, blanks
Faces workedBoth, simultaneously, between two plates
Thickness0.3 – 30 mm
Maximum workpieceØ290 mm (DL-290) · Ø395 mm (DL-395)
SemiconductorSilicon and gallium arsenide wafers
Optical & hard-brittleOptical glass, sapphire, quartz crystal, ceramic substrate
AlsoMetals and non-metals — send your material for a free trial run

Because a wafer lapping and polishing machine is judged on flatness, parallelism and thickness spread, those are the numbers to send. If you are choosing glass, the optical materials data helps, and drawings dimensioned to the ISO 10110 framework are ideal.

Silicon wafers, sapphire and ceramic substrates lapped flat on the DL wafer lapping and polishing machine
Finished flat parts — wafers and substrates, both faces to one thickness.
Datasheet

Technical specifications

Two sizes of the same double-sided platform. The DL-395 is the larger, higher-pressure machine; some DL-290 utility figures are confirmed with the quotation.

ParameterDL-290DL-395
Plate (OD × ID × H)Ø973 × Ø403 × 50 mmØ1165 × Ø377 × 50 mm
Star wheels65
Max workpieceØ290 mmØ395 mm
Thickness0.3 – 30 mm0.3 – 30 mm
Plate pressure400 kg700 kg
Installed powerConfirmed on quotationapprox. 18 kW
Overall dimensionsConfirmed on quotation1850 × 1500 × 2900 mm
Faces workedBoth, simultaneously
FrameGantry frame
DrivesThree VFD motors, independent speed and reversal
Pressure controlElectric proportional valve
Recipes8 parameter sets · 10 recipes
LubricationAutomatic, centralised
CertificationCE
Consumables

The lapping plates, star-wheel carriers, abrasive and polishing pads are process consumables chosen for the material and the flatness target. They are quoted separately.

Main assemblies and what each one is for

This is the vocabulary your operator and our service engineer will share on the shop floor.

DL wafer lapping and polishing machine principal assemblies with callouts to the plates, star wheels, sun and ring gears
Principal assemblies, callouts keyed to the table.
AssemblyFunction
Upper & lower platesThe two working surfaces the parts are lapped or polished between
Star-wheel carriersHold the parts and carry them on the planetary path; 6 on the DL-290, 5 on the DL-395
Sun & ring gearsDrive the carriers so each part spins and orbits at once
Gantry frame & liftCarries the upper plate and raises it to load and unload the carriers
Three VFD drivesUpper plate, lower plate and gears, each with its own speed and reversal
Proportional-valve pressureSets the plate load electrically
Central lubricationFeeds oil to the gear train from one point
Installation

Utilities, environment and safety

Electrical supply, coolant or slurry supply, floor loading and the ambient conditions the machine is to run in are confirmed with us for each order, together with the safety and protective arrangement supplied with it. These figures depend on the voltage and frequency of your site, the material you are running and the destination market, so we do not publish a single set of them here — and some DL-290 utility figures are confirmed with the quotation.

Send us the site conditions with your enquiry and we will return the utility and environmental requirements in writing, before the order is placed.

Fair warning

A wafer lapping and polishing machine is for flat parts — wafers, substrates and windows — not curved lenses; those go to the swinging-spindle polishers. Carriers are loaded by hand, and a new material needs its plate, abrasive and pressure proven on trial parts, the reason we ask for your parts before quoting.

What happens after the machine is installed?

The same terms apply to every machine we ship, wherever in the world it goes.

Warranty period12 months from final acceptance
Response during warrantyResponse within 8 hours · solution proposed within 24 hours · issue resolved within 48 hours, including procurement, installation and commissioning of parts
After the warranty periodService and spare parts available for the life of the machine
CertificationCE

Specifications are subject to change as a result of design upgrades. Minor differences may occur at certain parts. For a binding specification, refer to the order confirmation.

See the machine running

The DL platform lapping a carrier of parts between the two plates, and the star wheels tracing their planetary path.

01 — Double-sided lapping, one carrier of parts

02 — Star wheels on the planetary path

Next step

Send one drawing and a few parts

A wafer lapping and polishing machine is easy to specify badly from a datasheet. Send us the material, the diameter, the thickness, and the flatness and parallelism you have to hold, with a few of your own parts. We run them, return them, and send the process sheet with the quotation, along with the size — DL-290 or DL-395 — that fits your batch.

If your parts are curved rather than flat, we will point you to the lens polishers instead of quoting this one.

ISO 9001 certified · CE compliant · shipped to 20+ countries
12-month warranty · free trial run on customer-supplied material
Optics customers include Edmund Optics and Coherent

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