Technical Articles

Comparing Inner Diameter Saw and Diamond Wire Saw for Glass Wafer Cutting

Introduction Glass wafer cutting is a critical process in the manufacturing of semiconductors, MEMS sensors, optical substrates, and biomedical devices. The fragile nature and thin dimensions of these wafers require precision cutting methods that minimize chipping, maximize yield, and preserve surface integrity. Two widely used cutting technologies—inner diameter (ID) saws and diamond wire saws—offer different strengths and limitations. This article compares their key parameters and performance to help manufacturers select the most suitable solution. Inner Diameter Saw Overview Inner diameter saws use a circular blade with diamond abrasives coated on the inside edge. The wafer is fed into the rotating blade to perform the cut. Advantages: Limitations: Diamond Wire Saw Overview Diamond wire saws operate using a looped wire embedded with diamond abrasives. The wire moves continuously, slicing through the wafer using low-pressure, high-precision movement. Advantages: Limitations: Technical Comparison Feature Inner Diameter Saw Diamond Wire Saw Minimum Kerf Width ~0.25

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Why Diamond Wire Saw Is the Best Choice for Optical Crystal Machining

Introduction In the realm of optical crystal machining, achieving ultra-precise cuts with minimal material loss and no structural damage is vital. Materials like sapphire, quartz, and lithium niobate are widely used in high-performance optical systems, and they demand superior cutting techniques. Among all available methods, the diamond wire saw has emerged as the most effective tool for machining these delicate materials. This article explores why the diamond wire saw is superior to traditional cutting technologies, with a focus on surface quality, dimensional precision, and production efficiency. Superior Precision in Optical Crystal Machining The most critical factor in optical component manufacturing is cutting accuracy. Diamond wire saws offer remarkable precision, consistently achieving cutting kerfs as narrow as 0.4 mm, thanks to wire diameters as thin as 0.35 mm. Compared to conventional blade saws, which often exceed 0.5 mm in kerf width, diamond wire technology minimizes material loss and maximizes usable output.

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Key Techniques for Minimizing Chipping During Optical Lens Cutting

Introduction Optical lens cutting requires exceptional precision, especially as lens technology advances in fields like imaging, communications, and medical devices. A frequent challenge in this process is chipping — small fractures or flaking at the edges or surfaces of lenses. Chipping not only reduces product yield but also compromises the optical performance of the final component. This article explores effective methods to minimize chipping during optical lens cutting, with a focus on the benefits of using diamond wire saws over traditional methods. Precision Challenges in Optical Lens Cutting Optical lenses are typically made from brittle materials such as glass, quartz, or certain crystals. During cutting, mechanical stress, tool vibration, or improper cooling can induce microcracks or chips along the cut edges. These imperfections are especially problematic in high-precision applications like camera lenses or fiber optic connectors, where surface quality and structural integrity are critical. Advantages of Diamond Wire Sawing Diamond

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