Germanium wafers are essential substrates for infrared detectors, thermographic sensors, and optical components. However, Ge is a brittle semiconductor crystal prone to edge chipping and surface damage during cutting. Traditional blade-based methods often result in high material loss and poor edge quality. This article explains how to use diamond wire saw technology to precisely slice […]
Zinc sulfide (ZnS) is a key optical crystal widely used in infrared imaging systems, military optics, and precision manufacturing. While ZnS offers excellent infrared transmission and mechanical strength, it is also extremely brittle and prone to edge chipping during processing. Traditional cutting tools struggle to achieve clean, crack-free surfaces on ZnS, making advanced cutting technology
Introduction: The Fragility of Sapphire Under Pressure Sapphire wafers are prized in semiconductor, optoelectronic, and LED applications due to their superior hardness, optical transparency, and thermal stability. However, that same hardness also makes sapphire wafer cutting an inherently delicate process. When not properly controlled, cutting can introduce residual stresses that result in microcracks, edge chipping,
Как уменьшить стрессовые повреждения при резке сапфировых пластин Читать дальше »
Introduction Glass wafer cutting is a critical process in the manufacturing of semiconductors, MEMS sensors, optical substrates, and biomedical devices. The fragile nature and thin dimensions of these wafers require precision cutting methods that minimize chipping, maximize yield, and preserve surface integrity. Two widely used cutting technologies—inner diameter (ID) saws and diamond wire saws—offer different
Introduction In the realm of optical crystal machining, achieving ultra-precise cuts with minimal material loss and no structural damage is vital. Materials like sapphire, quartz, and lithium niobate are widely used in high-performance optical systems, and they demand superior cutting techniques. Among all available methods, the diamond wire saw has emerged as the most effective
Почему алмазная проволочная пила - лучший выбор для обработки оптических кристаллов Читать дальше »
Introduction Optical lens cutting requires exceptional precision, especially as lens technology advances in fields like imaging, communications, and medical devices. A frequent challenge in this process is chipping — small fractures or flaking at the edges or surfaces of lenses. Chipping not only reduces product yield but also compromises the optical performance of the final
Основные методы минимизации сколов при резке оптических линз Читать дальше »
Introduction: Sapphire substrates are essential components in LED manufacturing, optical devices, and semiconductor applications due to their exceptional hardness and thermal stability. However, cutting these substrates with precision is a significant challenge. Traditional methods like diamond blade sawing and laser cutting often lead to issues such as micro-cracks, thermal damage, and high material waste. To
Optical glass is a critical material used in high-precision applications such as lenses, prisms, and fiber optics. Achieving flawless surface quality and dimensional accuracy during the cutting process is essential to maintain optical performance. Traditional cutting methods often struggle with material stress, micro-cracks, and uneven surfaces, which can compromise the optical clarity and structural integrity
Технология алмазных проволочных пил повышает точность резки оптического стекла Читать дальше »
Мы являемся ведущим производителем оборудования для резки стекла с бесконечной алмазной проволокой.