Germanium wafers are essential substrates for infrared detectors, thermographic sensors, and optical components. However, Ge is a brittle semiconductor crystal prone to edge chipping and surface damage during cutting. Traditional blade-based methods often result in high material loss and poor edge quality.
This article explains how to use diamond wire saw technology to precisely slice germanium wafers with minimal damage and high yield.
Why Germanium Wafer Cutting Is Challenging
Germanium has:
- A low fracture toughness
- High density (~5.3 g/cm³)
- Low thermal conductivity (~60 W/m·K)
- Medium hardness (Mohs ~6)
These properties make it sensitive to both mechanical and thermal stress during slicing. Without proper process control, common issues include:
- Microcracks on the surface
- Edge flaking or breaking
- Excess kerf loss and low wafer yield
Advantages of Diamond Wire Saw Technology Endless diamond wire saws overcome these limitations with:
- Ultra-thin wire (as thin as 0.3 mm) for minimal kerf loss (~0.35 mm)
- Cold cutting that prevents heat-induced distortion
- Smooth slicing action that reduces mechanical vibration
- Programmable feed and wire speed for thin wafer control
- Clean, crack-free surface finish, often below 3 μm Ra
Recommended Cutting Parameters for Germanium Wafers
| Parameter | Suggested Value |
|---|---|
| Drahtdurchmesser | 0,3 mm |
| Vorschubgeschwindigkeit | 0.5–1.0 mm/min |
| Drahtgeschwindigkeit | 10–15 m/s |
| Cooling Method | Water-based coolant with filtration |
| Slice Thickness | As thin as 0.1 mm supported |
Proper fixturing is also critical: soft pressure pads and anti-slip supports help prevent lateral movement and fracture.
Customer Case Example
A leading IR sensor manufacturer uses the SG 20 to slice 1 mm thick Ge wafers from a small ingot. Results:
- Chipping near zero with no visible edge cracks
- Post-processing time reduced by 40%
Check The Cutting Video and the Perfect Cut Surface
Recommended Cutting Parameters for Germanium Wafers
| Parameter | Suggested Value |
|---|---|
| Drahtdurchmesser | 0,3 mm |
| Vorschubgeschwindigkeit | 5 mm/min |
| Drahtgeschwindigkeit | 35–60m/s |
| Cooling Method | Oil-based coolant with filtration |
| Slice Thickness | As thin as 0.1 mm supported |
Proper fixturing is also critical: soft pressure pads and anti-slip supports help prevent lateral movement and fracture.
Best Equipment for Ge Wafer Cutting
Vimfun recommends the following machines:
- SG20: For precision slicing
- SGI 20: For higher throughput and Contour cut
- SGR 20: For advanced multi-angle slicing or custom lens blanks
All models support precise control over tension, feed speed, and automated slicing routines.
Germanium wafer cutting demands low-stress, precision techniques to ensure product quality and process efficiency. Endless diamond wire saws deliver clean, thin slices with minimal material loss—ideal for the demands of infrared optics and semiconductor manufacturing.
Interested in upgrading your Ge wafer slicing line?
Contact Vimfun to discuss equipment configurations or request a cutting sample.