Einführung
Glass wafer cutting is a critical process in the manufacturing of semiconductors, MEMS sensors, optical substrates, and biomedical devices. The fragile nature and thin dimensions of these wafers require precision cutting methods that minimize chipping, maximize yield, and preserve surface integrity. Two widely used cutting technologies—inner diameter (ID) saws and diamond wire saws—offer different strengths and limitations. This article compares their key parameters and performance to help manufacturers select the most suitable solution.
Inner Diameter Saw Overview
Inner diameter saws use a circular blade with diamond abrasives coated on the inside edge. The wafer is fed into the rotating blade to perform the cut.
Vorteile:
- Extremely thin kerf (as low as 0.25 mm)
- Established process used in traditional semiconductor slicing
- High throughput for small-format wafers
Limitations:
- Limited cutting capacity—only suitable for materials smaller than the blade’s inner diameter
- High vibration during cutting increases chipping risk
- Surface finish requires post-polishing
- Frequent blade wear requires ongoing maintenance
Diamond Wire Saw Overview
Diamond wire saws operate using a looped wire embedded with diamond abrasives. The wire moves continuously, slicing through the wafer using low-pressure, high-precision movement.
Vorteile:
- Capable of cutting large materials (up to 2.5 meters in diameter)
- Lower cutting stress, reducing chipping and microcracks
- Smooth surface finish with reduced polishing loss
- Wire life is longer, lowering maintenance requirements
Limitations:
- Slightly wider kerf than ID saw (minimum ~0.35 mm)
- Requires precise tension and alignment
- Surface still requires polishing, though with lower material removal
Technical Comparison
| Merkmal | Inner Diameter Saw | Diamant-Seilsäge |
|---|---|---|
| Minimum Kerf Width | ~0.25 mm | ~0.35 mm |
| Max Cutting Diameter | < Blade Inner Diameter | Up to 2.5 m |
| Surface Finish | Rougher, requires polishing | Smooth, light polishing needed |
| Chipping Risk | Higher | Lower |
| Maintenance Frequency | Hoch | Niedrig |
| Tool Life | Shorter | Longer |
Application Suitability
ID saws are best suited for small, thin glass wafers where maximum material conservation is needed and part size is limited. However, when working with large-diameter wafers or thick substrates, ID saws are constrained by their physical blade diameter. Diamond wire saws shine in these scenarios, especially for large optics, fused silica, or thick borosilicate substrates.
Abschluss
While inner diameter saws offer narrower kerf cuts, they are restricted to small-sized materials and require frequent blade maintenance. Diamond wire saws provide versatility in size, smoother surfaces with less polishing loss, and lower mechanical stress, making them a more scalable and efficient option for modern glass wafer cutting.