Optical Filter Shaping Machine
SGI 20 is a compact, high-precision CNC endless diamond wire saw specifically designed for cutting small glass and ceramic components with complex contours. It supports both straight slicing und irregular 2D profiling, making it ideal for optical labs, filter manufacturers, and R&D institutions.
Key Features of SGI 20
- 1. Dual Cutting Functions: Slicing + Contour Shaping
Supports both straight line cutting and complex shape profiling using DXF file import. Ideal for filter glass, IR optics, and ceramic samples with curves, slots, or irregular forms. - 2. Compact Vertical Gantry Structure
The rigid gantry-style frame improves mechanical stability and cut consistency. Despite its compact footprint, SGI 20 accommodates workpieces up to 200 × 200 mm. - 3. High-Precision Motion System
YZ-axis linear travel of 200 mm × 200 mm is driven by servo motors with lead screws and guide rails, achieving ±0.01 mm positioning and ≤0.03 mm cutting accuracy. - 4. DXF-Compatible CNC Software
Users can import 2D CAD drawings directly for automatic toolpath generation. Built-in CAM supports arcs, diagonals, and straight-edge combinations. - 5. Endless Diamond Wire Cutting
Uses electroplated diamond wire (Ø0.35–0.8 mm), driven by a high-speed servo. Cutting loop length: 1797 mm. - 6. Automated Oil Lubrication + Water Cooling
Includes built-in water tank and circulation system for clean cutting, plus auto-lubrication for motion parts to reduce wear. - 7. Safety Features
Wire break detection, emergency stop, electrical protections, and proximity sensors are standard.
| Nein. | Name | Spezifikation |
| 1 | Maximale Werkstücklänge (mm) | 200 |
| 2 | Maximale Werkstückbreite (mm) | 200 |
| 3 | Maximale Werkstückhöhe (mm) | 200 |
| 4 | Verfahrweg der Y-Achse des Arbeitstisches (mm) | 200 |
| 5 | Verfahrweg der Z-Achse des Arbeitstisches (mm) | 220 |
| 6 | Maximale Diamantseilgeschwindigkeit (m/s) | 33 |
| 7 | Minimaler Vorschubschritt Y-Achse (mm) | 0.01 |
| 8 | Minimaler Vorschubschritt Z-Achse (mm) | 0.01 |
| 9 | Wiederholpositionierungsgenauigkeit Y-Achse (mm) | 0.01 |
| 10 | Wiederholpositionierungsgenauigkeit Z-Achse (mm) | 0.01 |
| 11 | Gesamtstromverbrauch (kW) | 1.5 |
| 12 | Stromversorgung | 220V 50Hz |
| 13 | Maschinengröße (mm) | 1044*950*1810 |
| 14 | Maschinengewicht (kg) | 600 |
CUTTING METHOD COMPARISON: SGI 20 VS. OTHER TECHNOLOGIES
When working with small, brittle materials such as optical filter glass, ceramics, or quartz plates, cutting precision and surface quality are critical. Here’s how the SGI 20’s CNC endless diamond wire system compares with other mainstream methods:
| Schnittmethode | Supports Complex Shapes | Precision Level | Suitable for Brittle Materials | Oberfläche | Thermal Impact | Typical Use Cases |
|---|---|---|---|---|---|---|
| CNC Diamond Wire Saw (e.g. SGI 20) | ✅ Fully supported (DXF import) | High (≤ 0.03 mm) | ⭐⭐⭐⭐ Excellent | ⭐⭐⭐ Ra ≤ 60 μm | Keiner | Filters, ceramic parts, optical glass windows |
| Laser schneiden | ✅ 2D shapes only | Medium (±0.1 mm) | ⭐ Limited (some glass only) | ⭐⭐ Often burnt edges | Yes (microcracks) | Patterning, engraving, logo marking |
| Wasserstrahlschneiden | ✅ Any 2D shape | Mittel | ⭐⭐ Acceptable but rough | ⭐ Rough | Keiner | Coarse profiling of large plates or ceramics |
| CNC Profile Grinding | ✅ Precise contours | High (≤ 0.01 mm) | ⭐⭐⭐⭐ Excellent | ⭐⭐⭐⭐ Mirror-grade | Keiner | Molds, optics base substrates, curved components |
| Ultrasonic / Vibration Machining | ✅ Internal & external shapes | Medium–High | ⭐⭐⭐ Good | ⭐⭐⭐ Clean | Keiner | Microchannels, complex slots in hard materials |
| Dicing Saw Systems | ⚠️ Mainly straight lines | High (≤ 0.05 mm) | ⭐⭐ Limited to wafers/tiles | ⭐⭐⭐ Moderate | Keiner | Die separation of ceramics, semiconductor wafers |
| Mechanical Milling (Rotary Tools) | ✅ Theoretically possible | Niedrig | ❌ High chance of edge chipping | ⭐ Poor | Yes (thermal + mechanical) | Rough contouring of metals or coarse glass parts |
Optisches Filterglas
Used for shaping and slicing narrowband filters, IR filtersund laser optics glass blanks. Supports high edge quality and tight dimensional tolerances for imaging and sensing applications.
Technical Ceramics
Processes materials like alumina (Al₂O₃), aluminum nitride (AlN), and other sintered ceramics used in RF modules, power electronicsund thermal substrates.
Quartz Plates and Micro-Lenses
Enables accurate cutting of small quartz windows, lens blanks, and optical waveguide substrates with smooth edges and minimal chipping.
Research Prototypes
R&D institutions use SGI 20 for rapid prototyping of complex test parts, including grooved samples, and curved geometries in both glass and ceramic.
Custom Sensor Windows and Substrates
Used for producing precision-shaped openings, slotsund custom contours in glass substrates for MEMS, LIDAR, and spectroscopy.
Welche maximale Dicke kann die Maschine beim Schneiden verarbeiten?
Was ist der Unterschied zwischen dieser Seilsäge und der BANDSÄGE?
Die Schnittgeschwindigkeit wäre ähnlich, aber die Schnittflächenqualität der Seilsäge ist viel besser und der Schnittfugenverlust ist geringer.