SGS180-90
The SGS180-90 is an industrial-grade diamond wire cutting machine designed for ultra-large optical glass blocks, particularly high-purity quartz. With a cutting capacity of up to 1800 mm in length，900 mm in width and 600 mm in height, this machine is ideal for large-format material processing in research institutes and industrial glass production lines.
Key Features of SGS180-90
Purpose-Built for Oversized Quartz Blocks
Engineered specifically for cutting ultra-large quartz glass materials up to 1800 mm in length and 900 mm in width and height, including high-purity blocks used in optical and semiconductor industries.
Oscillating Endless Diamond Wire Cutting
Equipped with a top-down cutting system that integrates high-speed endless diamond wire Và lateral oscillation, enabling smooth slicing with built-in polishing effect. This results in reduced surface roughness and minimal subsurface damage.
High-Speed Cutting with Clean Surface Finish
The oscillating motion increases cutting efficiency and produces mirror-like surfaces, eliminating the need for secondary polishing in many applications.
Scalable Structure for Extra-Large Loads
Thanks to the scalable gantry structure and adjustable stroke, the SGS180-90 can handle heavy and oversized blocks with no compromise in cutting quality or mechanical stability.
Side-Open Work Area for Easy Loading
Designed with an open-sided loading platform, enabling crane or forklift access to place large glass blocks easily and safely.
Customizable Clamping System
Supports integration of magnetic fixtures, vacuum chucks, or custom mechanical holders for securing large and heavy optical materials during slicing.
Low Kerf Loss and Precision Control
Delivers narrow kerf widths (0.4–0.6 mm) with highly repeatable parallel cuts. Ideal for applications where material conservation and cut uniformity are critical.
Fully Programmable Control System
The touchscreen interface allows users to adjust wire speed, oscillation amplitude, stroke, and cutting cycles for batch or prototype production with consistent results.
Stable and Low-Stress Cutting
The abrasive, oscillating motion combined with vertical top-down feeding produces ultra-low cutting force, preventing edge chipping, internal fractures, or material shift.
| No. | Tên | Specification |
| 1 | Chiều dài phôi tối đa (mm) | 1800 |
| 2 | Chiều rộng phôi tối đa (mm) | 900 |
| 3 | Chiều cao phôi tối đa (mm) | 600 |
| 4 | Hành trình trục Y của bàn làm việc (mm) | 1800 |
| 5 | Hành trình trục Z của bàn làm việc (mm) | 900 |
| 6 | Tốc độ dây kim cương tối đa (m/s) | 84 |
| 7 | Gia tăng nguồn cấp dữ liệu tối thiểu Trục Y (mm) | 0.01 |
| 8 | Trục Z tăng lượng nạp tối thiểu (mm) | 0.01 |
| 9 | Độ chính xác định vị lặp lại Trục Y (mm) | 0.01 |
| 10 | Độ chính xác định vị lặp lại Trục Z (mm) | 0.01 |
| 11 | Tổng công suất tiêu thụ (kW) | 4 |
| 12 | Nguồn cấp | 220V 50Hz |
| 13 | Kích thước máy (mm) | 2900*2000*2600 |
| 14 | Trọng lượng máy (kg) | 3800 |
| 15 | Air Pressure(MPa) | 0.5-0.8 |
industrial glass processors. Traditional cutting technologies often fall short when faced with blocks measuring up to 1800 mm in length and 900 mm in both width and height. The SGS180-90 diamond wire saw by Vimfun provides a purpose-built, scalable solution where other technologies cannot compete.
The Other Machines Are Commonly Used?
1. Multi-Wire Saw
Pros: High-efficiency slicing for wafer production
Cons:
Limited to fixed parallel slicing only
Complex, high-maintenance system with expensive consumables
Poor compatibility with irregular block sizes
Difficult clamping and alignment
2. Inner Diameter Saw (ID Saw)
Pros: Precision slicing for small, thin wafers
Cons:
Limited to workpieces under 300 mm
Unsuitable for large or thick quartz blocks
3. Diamond Band Saw
Pros: Long cutting stroke, low-cost equipment
Cons:
Cuts are rough and often inaccurate
Wide kerf (>1 mm) and low repeatability
High vibration and low stability for optical materials
4. EDM Wire Cut
Not applicable: Cannot be used for non-conductive materials like quartz.
Why SGS180-90 Is Superior
| Feature | SGS180-90 | Multi-Wire Saw | Band Saw | ID Saw |
|---|---|---|---|---|
| Max Workpiece Size |  (1.8m x 0.9m x 0.9m) |  Limited | Support frame needed |  Too small |
| Surface Quality | Cut + grind in one | Rough, needs polishing | Poor | Smooth |
| Cutting Flexibility | Top-down, programmable | Fixed direction | Flexible stroke | Limited |
| Chiều rộng Kerf | 0.4–0.6 mm | 0.1–0.3 mm | >1 mm | 0.3–0.6 mm |
| Operating Cost | Trung bình | Very High | Thấp | Trung bình |
| Ease of Use | Cao | Complex | Thấp | Trung bình |
Final Verdict
The SGS180-90 offers an unmatched combination of large-format cutting capacity, oscillating diamond wire technology, and surface quality control. It is the ideal machine for cutting oversized quartz blocks used in optics, semiconductors, and research applications. Where other machines require compromise, SGS180-90 delivers precision, efficiency, and scale without limitation.
Vimfun — Cut Bigger. Cut Better.
1️⃣ Optical Fiber Preform Manufacturing
Used for cutting high-purity quartz blocks as raw material for fiber preforms
Subsequent drawing into optical fibers
Requires long-stroke, low-stress slicing — a perfect match for the SGS180-90
2️⃣ IR Window & Optical Glass Fabrication
Processes large quartz blocks into IR windows and optical lens blanks
Demands high surface quality with zero chipping or microcracking
SGS180-90 provides clean, mirror-like cuts without secondary processing
3️⃣ Semiconductor Equipment Material Processing
Quartz is widely used for process chambers, tubes, and wafer carriers
Large quartz ingots must be cut into manageable sizes for CNC machining or polishing
Consistency and edge integrity are critical
4️⃣ Scientific Research and Material Preparation
Institutes and universities often need custom-sized quartz pieces for experiments
SGS180-90 enables high-efficiency rough cutting and sample preparation with minimal waste
5️⃣ Fused Silica Casting and Component Manufacturing
Cuts bulk fused silica ingots into usable blocks for component machining
Stable cutting with SGS180-90 improves production flow and downstream precision
6️⃣ Aerospace and Specialty Optics
Supports cutting of large, non-standard quartz glass used in aerospace IR windows, optical bases, and sensor housings
Ideal for applications where size, clarity, and stress control are essential
What is the maximum thickness the machine can handle for cutting?
What is the difference between this wire saw and BAND SAW?
The cutting speed would be similar, but wire saw’s cut surface quality is far more better. and the kerf loss is smaller.