Vertical Contour Cutting Machine
の SVI 50-40 is a vertical structured diamond wire cutting machine designed for high-precision cutting of medium to large-sized brittle materials, including quartz glass, technical ceramics, sapphire, and composites. This versatile model supports multiple cutting functions, including straight slicing, irregular profile contouring, and internal shape cutting—all in a single setup.
Key Features of SVI 50-40
Multi-Functional Cutting Capabilities
SVI 50-40 integrates three cutting modes: straight slicing, irregular contour cutting, and internal cavity shaping. This makes it ideal for applications involving both standard geometry and complex profiles, eliminating the need for multiple machines.- Vertical Semi-Enclosed Structure
Its upright cutting orientation is paired with a semi-enclosed body design, offering clear visibility into the working area while enhancing safety. The structure allows for easy loading/unloading and improves operator access during setup and monitoring. - Excellent Coolant & Chip Evacuation
The vertical layout allows gravity to assist in coolant drainage and debris removal. This natural flow helps prevent swarf buildup, reduces cutting heat, and maintains wire sharpness for longer, resulting in a cleaner cut surface. - High-Precision Motion System
Driven by a stepper motor and supported by a precision ball screw system, the machine achieves positioning accuracy of ±0.015 mm and surface flatness of ≤0.03 mm. This ensures dimensional control even on brittle or layered materials. - Pneumatic Wire Tension System
Equipped with an adjustable pneumatic tension unit, the system maintains consistent wire tension throughout the cutting cycle. This reduces vibration, prevents wire slippage, and ensures smooth movement across complex geometries. - Dedicated Control System for Straight & Irregular Cutting
The machine includes a dual-mode cutting system that supports automatic straight slicing as well as custom programmed paths for profile and inner contour cutting. Operators can switch between modes with ease via a touchscreen interface. Industrial Electrical Integration
The SHVI 50-40 is equipped with a 2.2 kW main motor and high-quality electrical components compliant with industrial standards. The control box is well-organized and supports reliable long-term operation under continuous use conditions.
| いや。 | 名称 | 仕様 |
| 1 | 最大ワーク長さ(mm) | 500 |
| 2 | 最大ワーク幅(mm) | 500 |
| 3 | 最大ワーク高さ(mm) | 400 |
| 4 | ワークテーブルX軸移動量(mm) | 500 |
| 5 | ワークテーブルY軸移動量(mm) | 500 |
| 6 | ダイヤモンド ワイヤの最大速度 (m/s) | 64 |
| 7 | Minimum Feed Increment X-Axis (mm) | 0.01 |
| 8 | Y軸最小送り量(mm) | 0.01 |
| 9 | Repeat Positioning Accuracy X-Axis (mm) | 0.01 |
| 10 | 繰り返し位置決め精度 Y軸(mm) | 0.01 |
| 11 | 総消費電力(kW) | 3.5 |
| 12 | 電源 | 380V 50Hz |
| 13 | 機械サイズ(mm) | 2500*2000*2400 |
| 14 | 機械重量(kg) | 2200 |
| 15 | 空気圧(MPa) | 0.5-0.8 |
Comparison: SVI 50-40 vs. Other Cutting Methods
Why Choose Diamond Wire Cutting for Hard and Brittle Materials
When it comes to cutting medium-to-large brittle materials like quartz, ceramics, and sapphire, not all cutting methods deliver the same results. Here’s how the SVI 50-40 vertical diamond wire saw compares to other mainstream technologies:
| Feature / Method | SVI 50-40<br>Vertical Diamond Wire Saw | レーザー切断 | ウォータージェット切断 | バンドソー | ID Saw |
|---|---|---|---|---|---|
| 切断精度 | ⭐⭐⭐⭐ ±0.1 mm | ⭐⭐ | ⭐⭐ | ⭐ | ⭐⭐⭐⭐ |
| 表面仕上げ | ⭐⭐⭐⭐ Smooth, low-stress | ⭐⭐ Often burned | ⭐⭐ Rough | ⭐ Rough | ⭐⭐⭐⭐ |
| 切り口幅 | ⭐⭐ 0.4–0.6 mm | ⭐ Varies | ⭐⭐ 1–2 mm | ⭐ >1 mm | ⭐⭐ ~0.3 mm |
| Supports Complex Shapes | ⭐⭐⭐⭐ Yes (contour & inner hole) | ⭐⭐⭐ Yes (2D only) | ⭐⭐⭐ Yes | ⭐ No | ⭐ No |
| 素材適合性 | ⭐⭐⭐⭐ Quartz, sapphire, ceramics, glass | ⭐ Some glass only | ⭐ Most, risk of cracks | ⭐ Limited | ⭐ Limited |
| Heat Impact | ⭐⭐⭐⭐ Minimal (abrasive method) | ❌ High thermal | ⭐ None | ⭐ Low | ⭐ Low |
| Cut Size Flexibility | ⭐⭐⭐⭐ Up to 500 mm blocks | ⭐ Small pieces | ⭐⭐ Medium blocks | ⭐⭐ | ⭐ Small |
| Ideal For | High-precision slicing & shaping of hard brittle materials | Thin sections, logos | Rough contour cutting | Basic segmentation | Thin wafer slicing only |
Quartz Glass Blocks
Precision slicing and shaping of optical-grade quartz for IR windows, filter bases, and lens blanks.
Technical Ceramics
Used in semiconductor packaging, power electronics, and thermal isolation structures.
Contour cutting of brittle ceramic tiles, discs, and structural prototypes.
Sapphire Components
Cutting LED substrates, laser optics, and watch crystal blanks.
Handles curved or internal cuts in large sapphire segments.
Fused Silica & Composite Glass
Pre-cutting of transparent fused materials used in scientific optics or aerospace viewing windows.
Inner-Hole & Slot Machining
Used to open internal slots or closed-loop features in fragile materials—without cracking or delamination.
Research-Grade Custom Geometries
Universities and research labs benefit from flexible programming to produce one-off components and sample testing structures.
機械がカットできる最大厚みは？
ワイヤーソーとバンドソーの違いは何ですか？
切断速度は同じようなものだが、ワイヤーソーの切断面の品質ははるかに優れている。