Comparación de la sierra de diámetro interior y la sierra de hilo de diamante para el corte de obleas de vidrio
Introduction Glass wafer cutting is a critical process in the manufacturing of semiconductors, MEMS sensors, optical substrates, and biomedical devices. The fragile nature and thin dimensions of these wafers require precision cutting methods that minimize chipping, maximize yield, and preserve surface integrity. Two widely used cutting technologies—inner diameter (ID) saws and diamond wire saws—offer different […]