풀 코팅 석영 커팅 와이어
그만큼 Full-Coated Diamond Wire Loop is an electroplated endless wire designed for high-precision cutting of brittle, hard, and high-value materials. The diamond abrasive is uniformly distributed around the entire circumference of the wire, enabling consistent cutting pressure 그리고 smooth surface quality throughout the loop’s life.
This type of wire is ideal for users seeking clean slicing with minimal chipping, narrow kerf, and excellent durability—widely used in optics, ceramics, semiconductors, and advanced materials.
주요 기능
1. Full-Circumference Abrasive Coating
The diamond grit is evenly electroplated across the entire outer surface of the wire loop, ensuring uniform material removal and minimal vibration during cutting.
2. Stable & Repeatable Performance
Delivers consistent cutting results, particularly useful for production environments and research applications that require tight tolerances.
3.Sanding-Like Surface Finish
Reduces micro-cracks and edge damage, producing a fine-cut surface suitable for post-polishing or direct use.
4. Narrow Kerf Width
Typical kerf ranges from 0.3 to 0.6 mm, allowing for minimal material waste and more slices per block.
5. Custom Loop Lengths Available
Each wire loop is tailored to the specific dimensions of your equipment (from 1000 mm to 5000+ mm circumference).
6. Compatible with Multiple Materials
Works effectively on optical glass, quartz, fused silica, alumina ceramics, sapphire, GaN, and brittle semiconductors.
| 와이어 직경 | Coating Type | Working Tension (N) | Break Tension (N) | Recommended Length | Cutting Application Examples |
|---|---|---|---|---|---|
| 0.30 mm | 전체 | 60 | 115 | 1M – 30M | Sapphire, quartz, filters |
| 0.35mm | 전체 | 75 | 150 | 1M – 30M | Optical glass, ceramic targets |
| 0.50 mm | 전체 | 100 | 200 | 1M – 30M | Technical ceramics, magnets |
| 0.60 mm | 전체 | 115 | 270 | 1M – 30M | Sapphire blocks, crystals |
| 0.80 mm | 전체 | 210 | 440 | 1M – 30M | Fused silica, larger optics |
| 1.00 mm | 전체 | 250 | 500 | 1M – 30M | Glass composites, ceramics |
광학 유리 절단
Filters, Domes, Prism Blanks
사파이어
Ingot and Wafer Slicing
Fused Quartz and Silica
Component Production
Magnetic Ceramic
Material Cutting
Silicon
Compound Semiconductor Wafer Processing
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