균열 없이 게르마늄 웨이퍼를 절단하는 방법: 정밀 다이아몬드 와이어 쏘 가이드
Germanium wafers are essential substrates for infrared detectors, thermographic sensors, and optical components. However, Ge is a brittle semiconductor crystal prone to edge chipping and surface damage during cutting. Traditional blade-based methods often result in high material loss and poor edge quality. This article explains how to use diamond wire saw technology to precisely slice […]
균열 없이 게르마늄 웨이퍼를 절단하는 방법: 정밀 다이아몬드 와이어 쏘 가이드 자세히보기"