SH200-R
그만큼 SH200-R is a horizontal endless diamond wire cutting machine purpose-built for slicing oversized brittle materials such as quartz, radiation shielding glass, and aerospace-grade optical components. With a wire length of 8.3 meters and support for workpieces up to 2000 mm in diameter, this machine delivers exceptional surface quality and stable performance across industrial-scale cutting tasks.
Key Features of this large-quartz-cutting-machine
Purpose-Built for Ultra Large Workpiece
Engineered specifically for Workpieces up to Ø2000 × 500 mm, such as large quartz cylinders and optical glass plates.끝없는 다이아몬드 와이어 커팅
Utilizes a high-speed endless diamond wire system for stable, smooth, and chip-free cutting of fragile graphite materials.- Horizontal Cutting Structure
Maximizes stability and accessibility for long or heavy materials, reducing vibration and material deformation. - Low Kerf Loss, High Precision
Achieves clean slicing with kerf widths as narrow as 0.8 mm, minimizing material waste and reducing edge damage. Easy Loading of Elongated Workpieces
Side-loading platform allows easy placement and alignment of large parts using cranes or rollers.- Ultra-Low Cutting Force
Abrasive cutting method reduces mechanical stress on delicate edges, preventing chipping or microfractures - Integrated Oil Mist Recovery System
Fully enclosed design with built-in oil mist collection for a cleaner, safer working environment—ideal for glass and optical material processing. Automatic Lubrication + Water Recycling
Built-in lubrication ensures durability; closed-loop water system minimizes environmental impact.
| 아니요. | 이름 | 사양 |
| 1 | Maximum Workpiece Dia (mm) | 2000 |
| 2 | Maximum Workpiece Dia (mm) | 2000 |
| 3 | 최대 공작물 높이(mm) | 500 |
| 4 | 워크테이블 X축 이동(mm) | 1015 |
| 5 | 작업대 Y축 이동(mm) | 550 |
| 6 | 최대 다이아몬드 와이어 속도(m/s) | 51 |
| 7 | Minimum Feed Increment X-Axis (mm) | 0.01 |
| 8 | 최소 이송 증가량 Y축(mm) | 0.01 |
| 9 | Repeat Positioning Accuracy X-Axis (mm) | 0.01 |
| 10 | 반복 위치 정확도 Y축(mm) | 0.01 |
| 11 | 총 소비전력(kW) | 5 |
| 12 | 전원공급장치 | 380V 50Hz |
| 13 | 기계크기(mm) | 4000*2753*2130 |
| 14 | 기계중량(kg) | 4000 |
| 15 | 기압(MPa) | 0.5-0.8 |
Cutting Methods for 2-Meter Diameter Optical Glass: A Practical Comparison
Cutting Methods for 2-Meter Diameter Optical Glass: A Practical Comparison 끝없는 다이아몬드 와이어 톱 Recommended
끝없는 다이아몬드 와이어 톱 장점:
Capable of continuously cutting large cylindrical or thick optical glass blocks
Narrow kerf (0.4–1.0 mm), minimal material loss
Delivers low-stress, chip-free, mirror-quality surfaces
Compatible with rotating workpiece setups for faster and more uniform cuts
Best For:
Oversized optical glass, quartz blocks, and radiation shielding glass with diameters >1 meter and thickness >100 mm
Multi-Wire Saw 제한적
Multi-Wire Saw 
제한적장점: High-efficiency slicing for batch wafer production
단점:
Fixed cutting direction; mainly for wafer-level slicing
Difficult to clamp and handle oversized blocks
제한 사항: Not suitable for segmenting large-diameter glass blocks
다이아몬드 띠톱 Partially Applicable
다이아몬드 띠톱 장점: Flexible machine structure, supports long cutting strokes
단점:
Wide kerf, rough cutting surfaces, prone to edge chipping
Low cutting speed and efficiency
Use Case: Acceptable for coarse pre-cutting of 2-meter glass, but not suitable for high-precision applications
Abrasive Waterjet Not Recommended
Abrasive Waterjet 
Not Recommended제한 사항:
Glass is thermally sensitive; waterjet may cause microcracks
Risk of contaminating valuable glass with water and abrasive slurry
Use Case: Better suited for small composite materials, not large-diameter optical glass
레이저 커팅 Not Suitable
레이저 커팅 제한 사항:
Ineffective on thick optical glass
High risk of edge fracture and poor surface quality
Use Case: Not viable for optical-grade segmenting of large glass blocks
결론:
결론:For cutting 2-meter diameter optical glass에서 끝없는 다이아몬드 와이어 톱 stands out as the most reliable and effective solution.
It offers unmatched capability in terms of size compatibility, surface quality, cutting safety, and stability. This makes it ideal for high-value applications in aerospace, radiation shielding, and scientific research involving large-format optical materials.
1️⃣ Large Quartz Crystals
Cutting oversized quartz ingots and blocks used in optics, semiconductors, and photonics
Ideal for pre-slicing high-purity materials before polishing or coating
2️⃣ Radiation Shielding Glass
Processing of leaded or high-density glass used in:
Nuclear research facilities
Medical CT or radiation shielding windows
Aerospace radiation protection systems
3️⃣ Aerospace-Grade Optical Components
Cutting ultra-clear, low-expansion glass materials used in:
Spaceborne optical windows
Satellite sensor shields
High-altitude reconnaissance lens blanks
4️⃣ High-Purity Ceramics & Fused Silica
Slicing large blocks of alumina, fused silica, and other engineering ceramics
Used in vacuum systems, semiconductor processing, and precision optics
5️⃣ Infrared Transparent Materials
Pre-cutting IR window materials like ZnSe substrates, sapphire, or specialty glass composites
Demands flat, clean surfaces with minimal microcracking
6️⃣ Scientific Research Materials
Institutions using SH200-R for material preparation, such as:
Large-diameter fused silica windows
Custom radiation sensor panels
Experimental shielding components
기계가 절단할 수 있는 최대 두께는 얼마입니까?
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절단 속도는 비슷하지만 와이어 톱의 절단 표면 품질이 훨씬 더 우수하고 커프 손실이 더 적습니다.