석영 슬라이싱 머신
그만큼 SH60-R is a high-precision horizontal endless diamond wire saw engineered for slicing quartz blocks, technical ceramics, and other hard, brittle materials. Equipped with a fully programmable YZ-axis motion system and a rotating loading table, SH60-R delivers consistent, chip-free cuts ideal for high-purity optical, semiconductor, and scientific glass applications.
주요 기능
끝없는 다이아몬드 와이어 커팅
Uses electroplated high-speed diamond wire loop to cut any material softer than diamond — including quartz, optical glass, silicon, and ceramics.Fully Programmable Slicing
Set your desired slice thickness and cutting speed, and the machine will complete the process automatically with ±0.01 mm feed precision.YZ Axis Motion + Rotary Platform
Dual-axis (YZ) linear system driven by servo motors, with a 360° continuously rotating worktable for consistent slicing surface contact.Touchscreen Interface
Equipped with a user-friendly English-language PLC system with touchscreen and hand controller for easy operation.Integrated Water Cooling & Circulation System
Built-in water tank and recirculation system ensure clean, low-temperature operation for sensitive optical materials.Automatic Lubrication System
Key moving parts are automatically lubricated to reduce wear and extend equipment lifespan, requiring minimal manual maintenance.Oil Mist Recovery Unit
Enclosed cutting chamber with built-in oil mist collection system, maintaining a cleaner, safer working environment during high-speed cutting.
| 매개변수 | Value |
|---|---|
| Worktable Diameter | Ø600 mm |
| Max Workpiece Height | 500 mm |
| Y-Axis Travel | 315 mm |
| Z-Axis Travel | 500 mm |
| 다이아몬드 와이어 길이 | ~3500 mm |
| Wire Diameter Range | 0.35 – 1.0 mm |
| Max Wire Speed | 84 m/s |
| Min Feed Increment (Y/Z) | 0.01 mm |
| Repeatability (Y/Z) | ±0.01 mm |
| Cutting Speed Range | 0–1000 mm/min (adjustable) |
| Guide Wheel Size | Ø250 mm / Ø180 mm |
| 모터 파워 | 0.75 kW (Max 2800 RPM) |
| 전원공급장치 | 220V, 50Hz, 3-phase |
| Machine Size (L×W×H) | 1646 × 1733 × 2010 mm |
| Net Weight | ~1300 kg |
| Irregular Shape Cutting | Not supported |
Comparison Table: Cutting Machines for Large Quartz Blocks
| 절단 방법 | 정도 | 표면 품질 | 커프 폭 | 속도 | Suitable Size | Material Loss | Typical Use Case |
|---|---|---|---|---|---|---|---|
| 끝없는 다이아몬드 와이어 톱 |  | | 0.6–0.9 mm | Very–High | Very Large | 낮은 | High-precision slicing of quartz, ceramics, glass |
| Multi-Wire Saw | | | 0.1–0.3 mm | Medium High | Medium–Large | 낮은 | High-throughput wafer slicing (less shape-flexible) |
| 다이아몬드 띠톱 | | | >1.0 mm | 중간 | Very Large | 높은 | Rough cutting, pre-segmentation |
| 워터젯 커팅 | | | ~1.0–2.0 mm | 중간 | Large | Medium–High | Shape-cutting of thick blocks, low thermal impact |
| 레이저 커팅 | | | Varies | 높은 | Small–Medium | Medium–High | Not ideal for quartz due to poor IR absorption |
| Inner Diameter (ID) Saw | | | ~0.3 mm | 낮은 | Small (≤300 mm) | 낮은 | Thin wafer slicing (small quartz rods/discs) |
Quartz Block Slicing
For optical substrates, IR windows, and high-purity photonic components.
Ceramic Material Processing
Suitable for Al₂O₃, AlN, Si₃N₄, and other engineering ceramics used in electronics and optics.
Optical Glass Plate Cutting
For clean slicing of optical components such as filter substrates or laser windows.
Semiconductor Material Pre-processing
For slicing silicon ingots or related high-value brittle materials.
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