유리 웨이퍼 슬라이싱 머신
그만큼 SG 20 is a high-precision gantry-structured wire saw specifically designed for slicing small optical glass, crystal, and ceramic parts. With a fully enclosed structure, touchscreen interface, and automatic thickness control, it delivers exceptional performance for both R&D and small-scale production.
주요 기능
1. High-Precision Slicing for Small Workpieces
Capable of slicing parts up to 200 × 200 × 220 mm, the machine uses an endless diamond wire (Ø0.3–1.0 mm) to achieve clean, low-damage slicing of hard, brittle, or high-value materials.
2. Dual Slicing Modes: Equal & Variable Thickness
Operators can choose between consistent-thickness mode and custom-thickness slicing for up to 10 different layers in one job.
3. Fully Enclosed Gantry Structure
Compact but sturdy gantry-style frame with full safety doors allows safe and quiet operation while reducing contamination and splash.
4. Intelligent Cutting Control System
Touchscreen + button-based control interface supports:
Kerf compensation
Peeling vs. non-peeling modes
Real-time slice thickness setting
Wire break detection and alarm
Production tracking and auto shutdown
5. Auto Lubrication & Fluid Cooling
Equipped with a water circulation system and automated lubrication system to ensure clean cutting conditions and reduced wear.
6. Oil Mist Collection Support
Compatible with optional oil mist recovery units for cleaner lab and production environments.
| 아니요. | 이름 | 사양 |
| 1 | 최대 공작물 길이(mm) | 200 |
| 2 | 최대 공작물 폭(mm) | 200 |
| 3 | 최대 공작물 높이(mm) | 220 |
| 4 | 작업대 Y축 이동(mm) | 200 |
| 5 | 작업대 Z축 이동(mm) | 220 |
| 6 | 최대 다이아몬드 와이어 속도(m/s) | 58 |
| 7 | 최소 이송 증가량 Y축(mm) | 0.01 |
| 8 | 최소 이송 증가량 Z축(mm) | 0.01 |
| 9 | 반복 위치 정확도 Y축(mm) | 0.01 |
| 10 | 반복 위치 정확도 Z축(mm) | 0.01 |
| 11 | 총 소비전력(kW) | 1.5 |
| 12 | 전원공급장치 | 220V 50Hz |
| 13 | 기계크기(mm) | 1044*943*1810 |
| 14 | 기계중량(kg) | 400 |
When slicing small, brittle materials like optical glass or ceramics, cutting precision and surface quality are critical. Here’s how the SG 20 stacks up against two commonly used cutting machines in labs and factories:
| Feature / Method | SG 20<br>다이아몬드 와이어 톱 | ID Saw<br>(Inner Diameter Saw) | Band Saw |
|---|---|---|---|
| 절단 정밀도 | ⭐⭐⭐⭐ ≤ 0.05 mm | ⭐⭐⭐⭐ High | ⭐ Low |
| 표면 품질 | ⭐⭐⭐⭐ Smooth, chip-free | ⭐⭐⭐ Good (may need polishing) | ⭐ Rough, high chipping |
| Slice Thickness Control | ⭐⭐⭐⭐ Programmable + multi-thickness | ⭐⭐ Manual setup per thickness | ❌ None |
| 커프 폭 | ⭐⭐ 0.3–0.6 mm | ⭐ 0.15–0.3 mm | ❌ >1.0 mm |
| Operation Simplicity | ⭐⭐⭐⭐ Touchscreen + auto feed | ⭐⭐ Requires trained technician | ⭐ Very basic |
| Tool Life & Cost | ⭐⭐ Mid | ❌ Blade wear costly | ⭐⭐ Low cost |
| Material Adaptability | ⭐⭐⭐⭐ Glass, ceramics, crystals | ⭐⭐ Thin wafers, specific sizes | ⚠️ Coarse blocks only |
| Automation Support | ✅ Full automatic slicing | ❌ Manual step-by-step | ❌ No automation |
Optical Glass Slicing
Used to cut filter glass, wavelength-selective windows, laser optics blanks, and protective glass substrates in small batches or R&D setups.
Ceramic Material Preparation
Perfect for slicing alumina, aluminum nitride, or sintered ceramics for electronic packaging, thermal insulation, or RF components.
Crystal Cutting
Enables accurate slicing of quartz plates, YAG blanks, or other photonic crystals for subsequent polishing or dicing.
Research Sample Preparation
Popular in academic labs for creating test pieces from hard or brittle materials with controlled thicknesses—supporting multi-slice, kerf-compensated, and peeling modes.
기계가 절단할 수 있는 최대 두께는 얼마입니까?
이 와이어 쏘와 밴드 쏘의 차이점은 무엇인가요?
절단 속도는 비슷하지만 와이어 톱의 절단 표면 품질이 훨씬 더 우수하고 커프 손실이 더 적습니다.