ゲルマニウム・ウェーハを割れずに切断する方法：精密ダイヤモンドワイヤーソーガイド
Germanium wafers are essential substrates for infrared detectors, thermographic sensors, and optical components. However, Ge is a brittle semiconductor crystal prone to edge chipping and surface damage during cutting. Traditional blade-based methods often result in high material loss and poor edge quality. This article explains how to use diamond wire saw technology to precisely slice […]
ゲルマニウム・ウェーハを割れずに切断する方法：精密ダイヤモンドワイヤーソーガイド 続きを読む "