サファイアウェハー切断時の応力ダメージを軽減する方法
Introduction: The Fragility of Sapphire Under Pressure Sapphire wafers are prized in semiconductor, optoelectronic, and LED applications due to their superior hardness, optical transparency, and thermal stability. However, that same hardness also makes sapphire wafer cutting an inherently delicate process. When not properly controlled, cutting can introduce residual stresses that result in microcracks, edge chipping, […]
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