infrared sensor material processing

Germanium wafers are essential substrates for infrared detectors, thermographic sensors, and optical components. However, Ge is a brittle semiconductor crystal prone to edge chipping and surface damage during cutting. Traditional blade-based methods often result in high material loss and poor edge quality. This article explains how to use diamond wire saw technology to precisely slice germanium wafers with minimal damage and high yield. Why Germanium Wafer Cutting Is Challenging Germanium has: These properties make it sensitive to both mechanical and thermal stress during slicing. Without proper process control, common issues include: Advantages of Diamond Wire Saw Technology Endless diamond wire saws overcome these limitations with: Recommended Cutting Parameters for Germanium […]