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ダイヤモンドワイヤーソーによるゲルマニウムレンズの切断

Germanium (Ge) is a high-value material widely used in infrared (IR) optics, night vision systems, thermal imaging, and scientific instruments. While germanium’s excellent infrared transmission and mechanical properties make it ideal for lenses, its crystalline brittleness makes cutting and processing extremely challenging. This article explains how endless diamond wire saws enable precision cutting of germanium lenses while minimizing surface damage and maximizing material yield. Material Characteristics of Germanium These features create unique machining challenges: Why Use Diamond Wire Saw for Germanium Lens Cutting? The endless diamond wire saw offers key advantages: Germanium Cutting Application Case One of our customers needed to cut a special arc-shaped geometry from a single-crystal germanium block. After multiple rounds of testing, our SGI20 model demonstrated exceptional cutting accuracy and contour control. The customer was highly satisfied with the results and proceeded to place three separate orders for multiple units to expand their precision optics production

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ゲルマニウム・ウェーハを割れずに切断する方法：精密ダイヤモンドワイヤーソーガイド

Germanium wafers are essential substrates for infrared detectors, thermographic sensors, and optical components. However, Ge is a brittle semiconductor crystal prone to edge chipping and surface damage during cutting. Traditional blade-based methods often result in high material loss and poor edge quality. This article explains how to use diamond wire saw technology to precisely slice germanium wafers with minimal damage and high yield. Why Germanium Wafer Cutting Is Challenging Germanium has: These properties make it sensitive to both mechanical and thermal stress during slicing. Without proper process control, common issues include: Advantages of Diamond Wire Saw Technology Endless diamond wire saws overcome these limitations with: Recommended Cutting Parameters for Germanium Wafers Parameter Suggested Value Wire Diameter 0.3 mm Feed Rate 0.5–1.0 mm/min Wire Speed 10–15 m/s Cooling Method Water-based coolant with filtration Slice Thickness As thin as 0.1 mm supported Proper fixturing is also critical: soft pressure pads and anti-slip

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サファイアウェハー切断時の応力ダメージを軽減する方法

Introduction: The Fragility of Sapphire Under Pressure Sapphire wafers are prized in semiconductor, optoelectronic, and LED applications due to their superior hardness, optical transparency, and thermal stability. However, that same hardness also makes sapphire wafer cutting an inherently delicate process. When not properly controlled, cutting can introduce residual stresses that result in microcracks, edge chipping, or even catastrophic wafer breakage. Reducing stress damage is not only about preserving wafer integrity—it also improves surface finish, reduces post-processing needs, and increases yield. In this article, we explore practical techniques and equipment configurations that help minimize stress during the sapphire cutting process. Understanding the Root Causes of Stress Damage Stress damage in sapphire wafers typically originates from three key factors: These stress sources can cause crack initiation at microstructural weak points, especially near the wafer’s edge or at contact points with cutting media. Optimizing Cutting Parameters for Sapphire One of the most effective

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ガラスウェーハ切断用内径鋸とダイヤモンドワイヤーソーの比較

Introduction Glass wafer cutting is a critical process in the manufacturing of semiconductors, MEMS sensors, optical substrates, and biomedical devices. The fragile nature and thin dimensions of these wafers require precision cutting methods that minimize chipping, maximize yield, and preserve surface integrity. Two widely used cutting technologies—inner diameter (ID) saws and diamond wire saws—offer different strengths and limitations. This article compares their key parameters and performance to help manufacturers select the most suitable solution. Inner Diameter Saw Overview Inner diameter saws use a circular blade with diamond abrasives coated on the inside edge. The wafer is fed into the rotating blade to perform the cut. Advantages: Limitations: Diamond Wire Saw Overview Diamond wire saws operate using a looped wire embedded with diamond abrasives. The wire moves continuously, slicing through the wafer using low-pressure, high-precision movement. Advantages: Limitations: Technical Comparison Feature Inner Diameter Saw Diamond Wire Saw Minimum Kerf Width ~0.25

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