Germanium (Ge) is a high-value material widely used in infrared (IR) optics, night vision systems, thermal imaging, and scientific instruments. While germanium’s excellent infrared transmission and mechanical properties make it ideal for lenses, its crystalline brittleness makes cutting and processing extremely challenging. This article explains how endless diamond wire saws enable precision cutting of germanium […]
ダイヤモンドワイヤーソーによるゲルマニウムレンズの切断 続きを読む "
Germanium wafers are essential substrates for infrared detectors, thermographic sensors, and optical components. However, Ge is a brittle semiconductor crystal prone to edge chipping and surface damage during cutting. Traditional blade-based methods often result in high material loss and poor edge quality. This article explains how to use diamond wire saw technology to precisely slice
ゲルマニウム・ウェーハを割れずに切断する方法：精密ダイヤモンドワイヤーソーガイド 続きを読む "
Zinc sulfide (ZnS) is a key optical crystal widely used in infrared imaging systems, military optics, and precision manufacturing. While ZnS offers excellent infrared transmission and mechanical strength, it is also extremely brittle and prone to edge chipping during processing. Traditional cutting tools struggle to achieve clean, crack-free surfaces on ZnS, making advanced cutting technology
エンドレスダイヤモンドワイヤーソーによるZnS（硫化亜鉛）の高精度切断 続きを読む "
Introduction: The Fragility of Sapphire Under Pressure Sapphire wafers are prized in semiconductor, optoelectronic, and LED applications due to their superior hardness, optical transparency, and thermal stability. However, that same hardness also makes sapphire wafer cutting an inherently delicate process. When not properly controlled, cutting can introduce residual stresses that result in microcracks, edge chipping,
サファイアウェハー切断時の応力ダメージを軽減する方法 続きを読む "
Introduction Glass wafer cutting is a critical process in the manufacturing of semiconductors, MEMS sensors, optical substrates, and biomedical devices. The fragile nature and thin dimensions of these wafers require precision cutting methods that minimize chipping, maximize yield, and preserve surface integrity. Two widely used cutting technologies—inner diameter (ID) saws and diamond wire saws—offer different
ガラスウェーハ切断用内径鋸とダイヤモンドワイヤーソーの比較 続きを読む "
Introduction In the realm of optical crystal machining, achieving ultra-precise cuts with minimal material loss and no structural damage is vital. Materials like sapphire, quartz, and lithium niobate are widely used in high-performance optical systems, and they demand superior cutting techniques. Among all available methods, the diamond wire saw has emerged as the most effective
ダイヤモンドワイヤーソーが光学結晶加工に最適な理由 続きを読む "
Introduction Optical lens cutting requires exceptional precision, especially as lens technology advances in fields like imaging, communications, and medical devices. A frequent challenge in this process is chipping — small fractures or flaking at the edges or surfaces of lenses. Chipping not only reduces product yield but also compromises the optical performance of the final
光学レンズ切断時のチッピングを最小限に抑える主な技術 続きを読む "
Introduction: Sapphire substrates are essential components in LED manufacturing, optical devices, and semiconductor applications due to their exceptional hardness and thermal stability. However, cutting these substrates with precision is a significant challenge. Traditional methods like diamond blade sawing and laser cutting often lead to issues such as micro-cracks, thermal damage, and high material waste. To
サファイア切断ソリューション：ダイヤモンドワイヤーソー技術による課題の克服 続きを読む "
Optical glass is a critical material used in high-precision applications such as lenses, prisms, and fiber optics. Achieving flawless surface quality and dimensional accuracy during the cutting process is essential to maintain optical performance. Traditional cutting methods often struggle with material stress, micro-cracks, and uneven surfaces, which can compromise the optical clarity and structural integrity
光学ガラスの切断精度を高めるダイヤモンドワイヤーソー技術 続きを読む "