Machine à trancher le quartz
Le SH60-R is a high-precision horizontal endless diamond wire saw engineered for slicing quartz blocks, technical ceramics, and other hard, brittle materials. Equipped with a fully programmable YZ-axis motion system and a rotating loading table, SH60-R delivers consistent, chip-free cuts ideal for high-purity optical, semiconductor, and scientific glass applications.
Caractéristiques principales
Coupe sans fin au fil diamanté
Uses electroplated high-speed diamond wire loop to cut any material softer than diamond — including quartz, optical glass, silicon, and ceramics.Fully Programmable Slicing
Set your desired slice thickness and cutting speed, and the machine will complete the process automatically with ±0.01 mm feed precision.YZ Axis Motion + Rotary Platform
Dual-axis (YZ) linear system driven by servo motors, with a 360° continuously rotating worktable for consistent slicing surface contact.Touchscreen Interface
Equipped with a user-friendly English-language PLC system with touchscreen and hand controller for easy operation.Integrated Water Cooling & Circulation System
Built-in water tank and recirculation system ensure clean, low-temperature operation for sensitive optical materials.Automatic Lubrication System
Key moving parts are automatically lubricated to reduce wear and extend equipment lifespan, requiring minimal manual maintenance.Oil Mist Recovery Unit
Enclosed cutting chamber with built-in oil mist collection system, maintaining a cleaner, safer working environment during high-speed cutting.
| Paramètre | Value |
|---|---|
| Worktable Diameter | Ø600 mm |
| Max Workpiece Height | 500 mm |
| Y-Axis Travel | 315 mm |
| Z-Axis Travel | 500 mm |
| Longueur du fil diamanté | ~3500 mm |
| Wire Diameter Range | 0.35 – 1.0 mm |
| Max Wire Speed | 84 m/s |
| Min Feed Increment (Y/Z) | 0.01 mm |
| Repeatability (Y/Z) | ±0,01 mm |
| Cutting Speed Range | 0–1000 mm/min (adjustable) |
| Guide Wheel Size | Ø250 mm / Ø180 mm |
| Puissance du moteur | 0.75 kW (Max 2800 RPM) |
| Source de courant | 220V, 50Hz, 3-phase |
| Machine Size (L×W×H) | 1646 × 1733 × 2010 mm |
| Net Weight | ~1300 kg |
| Irregular Shape Cutting | Not supported |
Comparison Table: Cutting Machines for Large Quartz Blocks
| Méthode de coupe | Précision | Qualité de la surface | Largeur de saignée | Vitesse | Suitable Size | Material Loss | Typical Use Case |
|---|---|---|---|---|---|---|---|
| Scie à fil diamanté sans fin |  | | 0.6–0.9 mm | Very–High | Very Large | Faible | High-precision slicing of quartz, ceramics, glass |
| Multi-Wire Saw | | | 0.1–0.3 mm | Medium High | Medium–Large | Faible | High-throughput wafer slicing (less shape-flexible) |
| Scie à ruban diamant | | | >1.0 mm | Moyen | Very Large | Haut | Rough cutting, pre-segmentation |
| Découpe au jet d'eau | | | ~1.0–2.0 mm | Moyen | Large | Medium–High | Shape-cutting of thick blocks, low thermal impact |
| Découpe au laser | | | Varies | Haut | Small–Medium | Medium–High | Not ideal for quartz due to poor IR absorption |
| Inner Diameter (ID) Saw | | | ~0.3 mm | Faible | Small (≤300 mm) | Faible | Thin wafer slicing (small quartz rods/discs) |
Quartz Block Slicing
For optical substrates, IR windows, and high-purity photonic components.
Ceramic Material Processing
Suitable for Al₂O₃, AlN, Si₃N₄, and other engineering ceramics used in electronics and optics.
Optical Glass Plate Cutting
For clean slicing of optical components such as filter substrates or laser windows.
Semiconductor Material Pre-processing
For slicing silicon ingots or related high-value brittle materials.
Quelle est l'épaisseur maximale que la machine peut traiter pour la découpe ?
Quelle est la différence entre cette scie à fil et la scie à ruban ?
La vitesse de coupe serait similaire, mais la qualité de la surface de coupe de la scie à fil est bien meilleure et la perte de kerf est plus faible.