Oscillating Wire Glass Slicer
Le SGSM 40 is a vertical machine de découpe de fil diamanté sans fin designed for efficient slicing of medium to large hard and brittle materials, including sapphire, alumina, quartz, and ceramics. Its key feature is the high-speed vertical cutting motion combined with programmable up-and-down wire swing, which provides a dual-action “cutting + polishing” effect—achieving smoother surfaces and faster throughput.
CARACTÉRISTIQUES PRINCIPALES
- 1. Swing-Wire Cutting for Smooth Surface Finish
The Z-axis wire motion includes programmable up-and-down oscillation during cutting. This swing action simulates a polishing effect on the surface, significantly improving finish quality and reducing edge chipping. - 2. Optimized for Medium to Large Hard Materials
Supports workpieces up to 400 × 400 × 400 mm, making it ideal for large ceramics, sapphire substrates, quartz blocks, and more. - 3. Full Enclosure with Gantry Structure
The vertical gantry frame ensures mechanical stability and cutting accuracy, while the fully enclosed cabinet enhances safety and dust control during high-speed cutting. - 4. Touchscreen + Handheld Control Interface
Equipped with a bilingual PLC system (Chinese/English), operators can set parameters such as swing degree, wire speed, and feed speed through an intuitive touchscreen and handheld remote. - 5. High-Speed Endless Wire System
Uses electroplated diamond wire (Ø0.35–1.0 mm) with a max linear speed of 38 m/s, driven by a 2100 RPM motor for fast, stable cutting. - 6. Servo-Driven Dual-Axis Feed
The Y and Z axes use ball screws and guide rails powered by servo motors, with a feed resolution of 0.01 mm and repeatability of ±0,02 mm. - 7. Integrated Cooling and Lubrication
Includes automatic oil lubrication for motion components and a water recycling system for cooling the cutting area, keeping surfaces clean and extending wire life.
| Non. | Nom | Spécifications |
| 1 | Longueur maximale de la pièce (mm) | 400 |
| 2 | Largeur maximale de la pièce (mm) | 420 |
| 3 | Hauteur maximale de la pièce (mm) | 350 |
| 4 | Déplacement de l'axe Y de la table de travail (mm) | 400 |
| 5 | Déplacement de l'axe Z de la table de travail (mm) | 350 |
| 6 | Vitesse maximale du fil diamanté (m/s) | 33 |
| 7 | Incrément d'avance minimum sur l'axe Y (mm) | 0.01 |
| 8 | Incrément d'alimentation minimum sur l'axe Z (mm) | 0.01 |
| 9 | Répéter la précision du positionnement sur l'axe Y (mm) | 0.01 |
| 10 | Répéter la précision du positionnement sur l'axe Z (mm) | 0.01 |
| 11 | Consommation électrique totale (kW) | 3.5 |
| 12 | Source de courant | 220V 50Hz |
| 13 | Taille de la machine (mm) | 1350*1050*1850 |
| 14 | Poids de la machine (kg) | 3500 |
| 15 | Pression atmosphérique (MPa) | 0.5-0.8 |
For the same swing-cutting method, we also offer the SGR40 model, which features workpiece oscillation instead of wire oscillation.
CUTTING METHOD COMPARISON
Fixed vs. Swing vs. Rotary: Choosing the Right Motion for Hard Materials
Endless diamond wire cutting offers multiple motion strategies, each optimized for different levels of hardness, speed, and surface requirements. Here’s how the three main methods compare:
| Method | Description | Vitesse de coupe | Qualité de la surface | Operation Complexity | Best For |
|---|---|---|---|---|---|
Fixed Wire Cutting(e.g. SG 40) | The wire and workpiece remain stationary in direction; straight slicing only | ⭐⭐ | ⭐⭐ | ⭐ Very simple | Medium-hard materials |
| Swing Cutting (e.g. SGSM 40) | Either the wire or the workpiece oscillates up and down during cutting | ⭐⭐⭐ | ⭐⭐⭐⭐ Excellent | ⭐⭐ Simple | Ultra-hard brittle materials |
| Rotary Cutting (e.g. SH40-R) | The workpiece rotates continuously (usually 360°) while being sliced | ⭐⭐⭐⭐ Fastest | ⭐⭐⭐ Good | ⭐⭐⭐ More complex | Ultra-hard components |
Sapphire Wafer Cutting
Used for slicing sapphire ingots or blocks into wafers for LED substrates, watch windows, optical domes, and sensor components. The swing-wire system reduces edge chipping and eliminates the need for post-polishing. crystal growth operations.
Silicon Carbide (SiC) Substrate Slicing
Supports clean slicing of SiC blocks or thick wafers used in high-voltage power electronics and EV semiconductors. Enables better wafer yield with low material loss.
Fused Quartz & Fused Silica
Precision slicing of high-purity quartz for optics, fiber preforms, and IR windows. The vibration-free cutting maintains transparency and dimensional consistency.
Alumina & Ceramic Components
Used to process dense ceramics like Al₂O₃ and AlN for electronic substrates, insulators, and laser modules. The smooth slicing surface reduces micro-cracking risks.
Infrared Glass & Crystal Materials
Processes specialty glasses like ZnS, Ge, and IR-transmitting ceramics for imaging systems, laser windows, and military optics.
R&D Prototyping of Hard Materials
Universities and labs rely on SGSM 40 for fast, precise, and repeatable cutting of small batches of brittle, expensive materials with minimal tooling.
Quelle est l'épaisseur maximale que la machine peut traiter pour la découpe ?
Quelle est la différence entre cette scie à fil et la scie à ruban ?
La vitesse de coupe serait similaire, mais la qualité de la surface de coupe de la scie à fil est bien meilleure et la perte de kerf est plus faible.