Comparaison entre la scie à diamètre intérieur et la scie à fil diamanté pour la découpe des plaquettes de verre
Introduction Glass wafer cutting is a critical process in the manufacturing of semiconductors, MEMS sensors, optical substrates, and biomedical devices. The fragile nature and thin dimensions of these wafers require precision cutting methods that minimize chipping, maximize yield, and preserve surface integrity. Two widely used cutting technologies—inner diameter (ID) saws and diamond wire saws—offer different […]