Optical Filter Shaping Machine
SGI 20 is a compact, high-precision CNC endless diamond wire saw specifically designed for cutting small glass and ceramic components with complex contours. It supports both straight slicing et irregular 2D profiling, making it ideal for optical labs, filter manufacturers, and R&D institutions.
Key Features of SGI 20
- 1. Dual Cutting Functions: Slicing + Contour Shaping
Supports both straight line cutting and complex shape profiling using DXF file import. Ideal for filter glass, IR optics, and ceramic samples with curves, slots, or irregular forms. - 2. Compact Vertical Gantry Structure
The rigid gantry-style frame improves mechanical stability and cut consistency. Despite its compact footprint, SGI 20 accommodates workpieces up to 200 × 200 mm. - 3. High-Precision Motion System
YZ-axis linear travel of 200 mm × 200 mm is driven by servo motors with lead screws and guide rails, achieving ±0.01 mm positioning and ≤0.03 mm cutting accuracy. - 4. DXF-Compatible CNC Software
Users can import 2D CAD drawings directly for automatic toolpath generation. Built-in CAM supports arcs, diagonals, and straight-edge combinations. - 5. Endless Diamond Wire Cutting
Uses electroplated diamond wire (Ø0.35–0.8 mm), driven by a high-speed servo. Cutting loop length: 1797 mm. - 6. Automated Oil Lubrication + Water Cooling
Includes built-in water tank and circulation system for clean cutting, plus auto-lubrication for motion parts to reduce wear. - 7. Safety Features
Wire break detection, emergency stop, electrical protections, and proximity sensors are standard.
| Non. | Nom | Spécifications |
| 1 | Longueur maximale de la pièce (mm) | 200 |
| 2 | Largeur maximale de la pièce (mm) | 200 |
| 3 | Hauteur maximale de la pièce (mm) | 200 |
| 4 | Déplacement de l'axe Y de la table de travail (mm) | 200 |
| 5 | Déplacement de l'axe Z de la table de travail (mm) | 220 |
| 6 | Vitesse maximale du fil diamanté (m/s) | 33 |
| 7 | Incrément d'avance minimum sur l'axe Y (mm) | 0.01 |
| 8 | Incrément d'alimentation minimum sur l'axe Z (mm) | 0.01 |
| 9 | Répéter la précision du positionnement sur l'axe Y (mm) | 0.01 |
| 10 | Répéter la précision du positionnement sur l'axe Z (mm) | 0.01 |
| 11 | Consommation électrique totale (kW) | 1.5 |
| 12 | Source de courant | 220V 50Hz |
| 13 | Taille de la machine (mm) | 1044*950*1810 |
| 14 | Poids de la machine (kg) | 600 |
CUTTING METHOD COMPARISON: SGI 20 VS. OTHER TECHNOLOGIES
When working with small, brittle materials such as optical filter glass, ceramics, or quartz plates, cutting precision and surface quality are critical. Here’s how the SGI 20’s CNC endless diamond wire system compares with other mainstream methods:
| Méthode de coupe | Supports Complex Shapes | Precision Level | Suitable for Brittle Materials | Finition de la surface | Thermal Impact | Typical Use Cases |
|---|---|---|---|---|---|---|
| CNC Diamond Wire Saw (e.g. SGI 20) | ✅ Fully supported (DXF import) | High (≤ 0.03 mm) | ⭐⭐⭐⭐ Excellent | ⭐⭐⭐ Ra ≤ 60 μm | Aucun | Filters, ceramic parts, optical glass windows |
| Découpe au laser | ✅ 2D shapes only | Medium (±0.1 mm) | ⭐ Limited (some glass only) | ⭐⭐ Often burnt edges | Yes (microcracks) | Patterning, engraving, logo marking |
| Découpe au jet d'eau | ✅ Any 2D shape | Moyen | ⭐⭐ Acceptable but rough | ⭐ Rough | Aucun | Coarse profiling of large plates or ceramics |
| CNC Profile Grinding | ✅ Precise contours | High (≤ 0.01 mm) | ⭐⭐⭐⭐ Excellent | ⭐⭐⭐⭐ Mirror-grade | Aucun | Molds, optics base substrates, curved components |
| Ultrasonic / Vibration Machining | ✅ Internal & external shapes | Medium–High | ⭐⭐⭐ Good | ⭐⭐⭐ Clean | Aucun | Microchannels, complex slots in hard materials |
| Dicing Saw Systems | ⚠️ Mainly straight lines | High (≤ 0.05 mm) | ⭐⭐ Limited to wafers/tiles | ⭐⭐⭐ Moderate | Aucun | Die separation of ceramics, semiconductor wafers |
| Mechanical Milling (Rotary Tools) | ✅ Theoretically possible | Faible | ❌ High chance of edge chipping | ⭐ Poor | Yes (thermal + mechanical) | Rough contouring of metals or coarse glass parts |
Optical Filter Glass
Used for shaping and slicing narrowband filters, IR filters, and laser optics glass blanks. Supports high edge quality and tight dimensional tolerances for imaging and sensing applications.
Technical Ceramics
Processes materials like alumina (Al₂O₃), aluminum nitride (AlN), and other sintered ceramics used in RF modules, power electronics, and thermal substrates.
Quartz Plates and Micro-Lenses
Enables accurate cutting of small quartz windows, lens blanks, and optical waveguide substrates with smooth edges and minimal chipping.
Research Prototypes
R&D institutions use SGI 20 for rapid prototyping of complex test parts, including grooved samples, and curved geometries in both glass and ceramic.
Custom Sensor Windows and Substrates
Used for producing precision-shaped openings, slots, and custom contours in glass substrates for MEMS, LIDAR, and spectroscopy.
Quelle est l'épaisseur maximale que la machine peut traiter pour la découpe ?
Quelle est la différence entre cette scie à fil et la scie à ruban ?
La vitesse de coupe serait similaire, mais la qualité de la surface de coupe de la scie à fil est bien meilleure et la perte de kerf est plus faible.