Solutions de coupe du saphir : Relever les défis grâce à la technologie des scies à fil diamanté
Introduction: Sapphire substrates are essential components in LED manufacturing, optical devices, and semiconductor applications due to their exceptional hardness and thermal stability. However, cutting these substrates with precision is a significant challenge. Traditional methods like diamond blade sawing and laser cutting often lead to issues such as micro-cracks, thermal damage, and high material waste. To overcome these limitations, diamond wire saw technology has emerged as an advanced solution that enhances precision and reduces waste. 1. Challenges in Sapphire Substrate Cutting Cutting sapphire substrates is particularly demanding due to its unique properties: These challenges highlight the need for more precise and less invasive cutting technologies, such as diamond wire saws. 2. Advantages of Diamond Wire Saw Technology Diamond wire sawing offers several benefits over traditional methods: Compared to laser and diamond blade cutting, diamond wire sawing delivers superior surface integrity and yield optimization. 3. Comparing Diamond Wire Saw with Traditional Methods Parameter Diamond