Introduction: Sapphire substrates are essential components in LED manufacturing, optical devices, and semiconductor applications due to their exceptional hardness and thermal stability. However, cutting these substrates with precision is a significant challenge. Traditional methods like diamond blade sawing and laser cutting often lead to issues such as micro-cracks, thermal damage, and high material waste. To

Optical glass is a critical material used in high-precision applications such as lenses, prisms, and fiber optics. Achieving flawless surface quality and dimensional accuracy during the cutting process is essential to maintain optical performance. Traditional cutting methods often struggle with material stress, micro-cracks, and uneven surfaces, which can compromise the optical clarity and structural integrity