SH200-R
The SH200-R is a horizontal endless diamond wire cutting machine purpose-built for slicing oversized brittle materials such as quartz, radiation shielding glass, and aerospace-grade optical components. With a wire length of 8.3 meters and support for workpieces up to 2000 mm in diameter, this machine delivers exceptional surface quality and stable performance across industrial-scale cutting tasks.
Key Features of this large-quartz-cutting-machine
Purpose-Built for Ultra Large Workpiece
Engineered specifically for Workpieces up to Ø2000 × 500 mm, such as large quartz cylinders and optical glass plates.Endless Diamond Wire Cutting
Utilizes a high-speed endless diamond wire system for stable, smooth, and chip-free cutting of fragile graphite materials.- Horizontal Cutting Structure
Maximizes stability and accessibility for long or heavy materials, reducing vibration and material deformation. - Low Kerf Loss, High Precision
Achieves clean slicing with kerf widths as narrow as 0.8 mm, minimizing material waste and reducing edge damage. Easy Loading of Elongated Workpieces
Side-loading platform allows easy placement and alignment of large parts using cranes or rollers.- Ultra-Low Cutting Force
Abrasive cutting method reduces mechanical stress on delicate edges, preventing chipping or microfractures - Integrated Oil Mist Recovery System
Fully enclosed design with built-in oil mist collection for a cleaner, safer working environment—ideal for glass and optical material processing. Automatic Lubrication + Water Recycling
Built-in lubrication ensures durability; closed-loop water system minimizes environmental impact.
| No. | Name | Specification |
| 1 | Maximum Workpiece Dia (mm) | 2000 |
| 2 | Maximum Workpiece Dia (mm) | 2000 |
| 3 | Maximum Workpiece Height (mm) | 500 |
| 4 | Worktable X-Axis Travel (mm) | 1015 |
| 5 | Worktable Y-Axis Travel (mm) | 550 |
| 6 | Maximum Diamond Wire Speed (m/s) | 51 |
| 7 | Minimum Feed Increment X-Axis (mm) | 0.01 |
| 8 | Minimum Feed Increment Y-Axis (mm) | 0.01 |
| 9 | Repeat Positioning Accuracy X-Axis (mm) | 0.01 |
| 10 | Repeat Positioning Accuracy Y-Axis (mm) | 0.01 |
| 11 | Total Power Consumption (kW) | 5 |
| 12 | Power Supply | 380V 50Hz |
| 13 | Machine Size(mm) | 4000*2753*2130 |
| 14 | Machine Weight(kg) | 4000 |
| 15 | Air Pressure(MPa) | 0.5-0.8 |
Cutting Methods for 2-Meter Diameter Optical Glass: A Practical Comparison
Endless Diamond Wire Saw Recommended
Advantages:
Capable of continuously cutting large cylindrical or thick optical glass blocks
Narrow kerf (0.4–1.0 mm), minimal material loss
Delivers low-stress, chip-free, mirror-quality surfaces
Compatible with rotating workpiece setups for faster and more uniform cuts
Best For:
Oversized optical glass, quartz blocks, and radiation shielding glass with diameters >1 meter and thickness >100 mm
Multi-Wire Saw 
Limited
Advantages: High-efficiency slicing for batch wafer production
Disadvantages:
Fixed cutting direction; mainly for wafer-level slicing
Difficult to clamp and handle oversized blocks
Limitations: Not suitable for segmenting large-diameter glass blocks
Diamond Band Saw Partially Applicable
Advantages: Flexible machine structure, supports long cutting strokes
Disadvantages:
Wide kerf, rough cutting surfaces, prone to edge chipping
Low cutting speed and efficiency
Use Case: Acceptable for coarse pre-cutting of 2-meter glass, but not suitable for high-precision applications
Abrasive Waterjet 
Not Recommended
Limitations:
Glass is thermally sensitive; waterjet may cause microcracks
Risk of contaminating valuable glass with water and abrasive slurry
Use Case: Better suited for small composite materials, not large-diameter optical glass
Laser Cutting Not Suitable
Limitations:
Ineffective on thick optical glass
High risk of edge fracture and poor surface quality
Use Case: Not viable for optical-grade segmenting of large glass blocks
Conclusion:
For cutting 2-meter diameter optical glass, the endless diamond wire saw stands out as the most reliable and effective solution.
It offers unmatched capability in terms of size compatibility, surface quality, cutting safety, and stability. This makes it ideal for high-value applications in aerospace, radiation shielding, and scientific research involving large-format optical materials.
1️⃣ Large Quartz Crystals
Cutting oversized quartz ingots and blocks used in optics, semiconductors, and photonics
Ideal for pre-slicing high-purity materials before polishing or coating
2️⃣ Radiation Shielding Glass
Processing of leaded or high-density glass used in:
Nuclear research facilities
Medical CT or radiation shielding windows
Aerospace radiation protection systems
3️⃣ Aerospace-Grade Optical Components
Cutting ultra-clear, low-expansion glass materials used in:
Spaceborne optical windows
Satellite sensor shields
High-altitude reconnaissance lens blanks
4️⃣ High-Purity Ceramics & Fused Silica
Slicing large blocks of alumina, fused silica, and other engineering ceramics
Used in vacuum systems, semiconductor processing, and precision optics
5️⃣ Infrared Transparent Materials
Pre-cutting IR window materials like ZnSe substrates, sapphire, or specialty glass composites
Demands flat, clean surfaces with minimal microcracking
6️⃣ Scientific Research Materials
Institutions using SH200-R for material preparation, such as:
Large-diameter fused silica windows
Custom radiation sensor panels
Experimental shielding components
What is the maximum thickness the machine can handle for cutting?
What is the difference between this wire saw and BAND SAW?
The cutting speed would be similar, but wire saw’s cut surface quality is far more better. and the kerf loss is smaller.