{"id":4869,"date":"2026-05-29T11:28:14","date_gmt":"2026-05-29T03:28:14","guid":{"rendered":"https:\/\/www.opticalcutting.com\/?post_type=product&#038;p=4869"},"modified":"2026-05-29T11:29:27","modified_gmt":"2026-05-29T03:29:27","slug":"sg-40-germanium-wafer-slicing-machine","status":"publish","type":"product","link":"https:\/\/www.opticalcutting.com\/de\/sg-40-germanium-wafer-slicing-machine\/","title":{"rendered":"SG 40"},"content":{"rendered":"\t\t<div data-elementor-type=\"product-post\" data-elementor-id=\"4869\" class=\"elementor elementor-4869\" data-elementor-post-type=\"product\">\n\t\t\t\t<div class=\"elementor-element elementor-element-0354d8b e-con-full e-flex e-con e-parent\" data-id=\"0354d8b\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-3c03b15 elementor-widget elementor-widget-html\" data-id=\"3c03b15\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"html.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<!DOCTYPE html>\n<html lang=\"en\">\n<head>\n<meta charset=\"UTF-8\">\n<meta name=\"viewport\" content=\"width=device-width, initial-scale=1.0\">\n<title>Germanium Wafer Slicing Machine: Multi-Thickness, 0.5 mm Kerf<\/title>\n<meta name=\"description\" content=\"The SG40 germanium wafer slicing machine cuts Ge ingots into wafers at ~0.5 mm kerf, with mixed thicknesses in one automatic job. Request a sample cut.\">\n<link rel=\"canonical\" href=\"https:\/\/www.opticalcutting.com\/germanium-wafer-slicing-machine\/\">\n<link rel=\"preconnect\" href=\"https:\/\/fonts.googleapis.com\">\n<link rel=\"preconnect\" href=\"https:\/\/fonts.gstatic.com\" crossorigin>\n<link href=\"https:\/\/fonts.googleapis.com\/css2?family=Sora:wght@500;600;700;800&family=Mulish:wght@400;500;600;700&family=IBM+Plex+Mono:wght@500;600&display=swap\" rel=\"stylesheet\">\n<style>\n  :root{\n    --white:#ffffff;\n    --bg:#F2F8FD;\n    --bg-2:#D5E8F6;\n    --ink:#14202C;\n    --ink-soft:#4E5C72;\n    --blue:#0274BE;\n    --blue-dark:#015A93;\n    --blue-deep:#013D66;\n    --blue-tint:#E1F0FB;\n    --line:#DCE7EF;\n    --line-2:#B8DBEF;\n    --sans:'Mulish',sans-serif;\n    --disp:'Sora',sans-serif;\n    --mono:'IBM Plex Mono',monospace;\n  }\n  *{margin:0;padding:0;box-sizing:border-box}\n  html{scroll-behavior:smooth}\n  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.play{width:62px;height:62px;border-radius:50%;background:var(--blue);display:grid;place-items:center;box-shadow:0 12px 30px -8px rgba(1,90,147,.65);transition:.16s}\n  .video-ph:hover .play{transform:scale(1.06);background:var(--blue-dark)}\n  .video-ph .play svg{width:24px;height:24px;fill:#fff;margin-left:3px}\n  .video-ph .t{position:absolute;bottom:14px;left:0;right:0;text-align:center;font-family:var(--mono);font-size:11px;color:var(--blue-deep);font-weight:600;padding:0 12px}\n  .rise{opacity:0;transform:translateY(14px);animation:rise .7s cubic-bezier(.2,.7,.2,1) forwards}\n  .d1{animation-delay:.04s}.d2{animation-delay:.12s}.d3{animation-delay:.2s}.d4{animation-delay:.28s}.d5{animation-delay:.36s}\n  @keyframes rise{to{opacity:1;transform:none}}\n  @media(prefers-reduced-motion:reduce){.rise{animation:none;opacity:1;transform:none}}\n  .geo *{vector-effect:non-scaling-stroke}\n<\/style>\n<\/head>\n<body>\n\n<section class=\"hero\">\n  <div class=\"wrap\">\n    <div>\n      <div class=\"model-line rise d1\">SG40 \u00b7 Endless Diamond Wire Saw<\/div>\n      <h1 class=\"rise d2\">Germanium Wafer Slicing Machine<\/h1>\n      <p class=\"lede rise d2\">Automatic, <strong>high-throughput slicing<\/strong> of germanium ingots into wafers \u2014 same <strong>~0.5&nbsp;mm closed-loop kerf<\/strong> as the rotary-equipped models, on a leaner machine for shops that just need round discs at volume.<\/p>\n      <div class=\"chips rise d3\">\n        <div class=\"chip\"><div class=\"v\">~0.5<small>&nbsp;mm<\/small><\/div><div class=\"l\">Wire kerf<\/div><\/div>\n        <div class=\"chip\"><div class=\"v\">\u00b10.01<small>&nbsp;mm<\/small><\/div><div class=\"l\">Repeatability<\/div><\/div>\n        <div class=\"chip\"><div class=\"v\">400\u00d7400<small>&nbsp;mm<\/small><\/div><div class=\"l\">Worktable<\/div><\/div>\n        <div class=\"chip\"><div class=\"v\">52<small>&nbsp;m\/s<\/small><\/div><div class=\"l\">Max wire speed<\/div><\/div>\n      <\/div>\n      <div class=\"hero-actions rise d4\">\n        <a class=\"btn\" href=\"#quote\"><svg viewBox=\"0 0 24 24\" fill=\"none\" stroke=\"currentColor\" stroke-width=\"2.2\"><path d=\"M5 12h14M13 6l6 6-6 6\"\/><\/svg>Get a sample cut<\/a>\n        <a class=\"btn btn-ghost\" href=\"#video\">Watch it slice<\/a>\n      <\/div>\n    <\/div>\n    <div class=\"hero-visual rise d3\">\n      <div class=\"vhead\"><span>FIG.01 \u2014 AUTOMATIC WAFER SLICING<\/span><b>SG40<\/b><\/div>\n      <div class=\"vbody\">\n        <svg class=\"geo\" viewBox=\"0 0 460 290\" width=\"100%\" role=\"img\" aria-label=\"SG40 closed-loop wire slicing a germanium cylinder into a stack of mixed-thickness wafers with a 0.5 mm kerf callout\">\n          <defs><marker id=\"ar\" markerWidth=\"9\" markerHeight=\"9\" refX=\"6\" refY=\"4.2\" orient=\"auto\"><path d=\"M0 0 L9 4.2 L0 8.4 z\" fill=\"#0274BE\"\/><\/marker><\/defs>\n          <!-- ingot (vertical cylinder, side view) -->\n          <ellipse cx=\"135\" cy=\"48\" rx=\"42\" ry=\"10\" fill=\"#D5E8F6\" stroke=\"#015A93\" stroke-width=\"1.6\"\/>\n          <rect x=\"93\" y=\"48\" width=\"84\" height=\"200\" fill=\"#D5E8F6\" stroke=\"#015A93\" stroke-width=\"1.6\"\/>\n          <ellipse cx=\"135\" cy=\"248\" rx=\"42\" ry=\"10\" fill=\"#015A93\"\/>\n          <!-- programmed cut lines (mixed thickness) -->\n          <line x1=\"93\" y1=\"82\" x2=\"177\" y2=\"82\" stroke=\"#0274BE\" stroke-width=\"1\" stroke-dasharray=\"2 3\"\/>\n          <line x1=\"93\" y1=\"118\" x2=\"177\" y2=\"118\" stroke=\"#0274BE\" stroke-width=\"1\" stroke-dasharray=\"2 3\"\/>\n          <line x1=\"93\" y1=\"178\" x2=\"177\" y2=\"178\" stroke=\"#0274BE\" stroke-width=\"1\" stroke-dasharray=\"2 3\"\/>\n          <line x1=\"93\" y1=\"216\" x2=\"177\" y2=\"216\" stroke=\"#0274BE\" stroke-width=\"1\" stroke-dasharray=\"2 3\"\/>\n          <!-- wire crossing the ingot horizontally at the current cut -->\n          <line x1=\"30\" y1=\"148\" x2=\"240\" y2=\"148\" stroke=\"#14202C\" stroke-width=\"2\"\/>\n          <text x=\"36\" y=\"140\" font-family=\"IBM Plex Mono\" font-size=\"11\" fill=\"#4E5C72\">\u00d80.4 mm wire<\/text>\n          <!-- wire travel arrow -->\n          <path d=\"M210 132 L240 132\" fill=\"none\" stroke=\"#0274BE\" stroke-width=\"1.4\" marker-end=\"url(#ar)\"\/>\n          <!-- kerf bracket -->\n          <line x1=\"184\" y1=\"144\" x2=\"200\" y2=\"144\" stroke=\"#0274BE\" stroke-width=\"1.4\"\/>\n          <line x1=\"184\" y1=\"152\" x2=\"200\" y2=\"152\" stroke=\"#0274BE\" stroke-width=\"1.4\"\/>\n          <text x=\"208\" y=\"155\" font-family=\"IBM Plex Mono\" font-size=\"12\" fill=\"#015A93\">kerf \u2248 0.5<\/text>\n          <!-- output stack of wafers (right side) -->\n          <ellipse cx=\"346\" cy=\"74\" rx=\"44\" ry=\"10\" fill=\"rgba(2,116,190,.18)\" stroke=\"#0274BE\" stroke-width=\"1.5\"\/>\n          <ellipse cx=\"346\" cy=\"106\" rx=\"44\" ry=\"10\" fill=\"rgba(2,116,190,.18)\" stroke=\"#0274BE\" stroke-width=\"1.5\"\/>\n          <ellipse cx=\"346\" cy=\"138\" rx=\"44\" ry=\"10\" fill=\"rgba(2,116,190,.18)\" stroke=\"#0274BE\" stroke-width=\"1.5\"\/>\n          <ellipse cx=\"346\" cy=\"174\" rx=\"44\" ry=\"10\" fill=\"rgba(2,116,190,.18)\" stroke=\"#0274BE\" stroke-width=\"1.5\"\/>\n          <ellipse cx=\"346\" cy=\"210\" rx=\"44\" ry=\"10\" fill=\"rgba(2,116,190,.18)\" stroke=\"#0274BE\" stroke-width=\"1.5\"\/>\n          <!-- transfer hint -->\n          <path d=\"M222 148 Q278 110 298 92\" fill=\"none\" stroke=\"#015A93\" stroke-width=\"1.3\" stroke-dasharray=\"3 4\" marker-end=\"url(#ar)\"\/>\n          <text x=\"400\" y=\"100\" font-family=\"IBM Plex Mono\" font-size=\"11\" fill=\"#4E5C72\">mixed<\/text>\n          <text x=\"400\" y=\"116\" font-family=\"IBM Plex Mono\" font-size=\"11\" fill=\"#4E5C72\">thickness<\/text>\n          <text x=\"400\" y=\"132\" font-family=\"IBM Plex Mono\" font-size=\"11\" fill=\"#4E5C72\">stack<\/text>\n        <\/svg>\n      <\/div>\n      <div class=\"vcap\">Programmable multi-thickness slicing in one automatic job \u2014 mix 3&nbsp;mm windows with 8&nbsp;mm lens blanks off the same ingot.<\/div>\n    <\/div>\n  <\/div>\n<\/section>\n\n<!-- MACHINE APPEARANCE -->\n<section>\n  <div class=\"wrap\">\n    <div class=\"sec-head\">\n      <div class=\"eyebrow\">The Machine<\/div>\n      <h2>A high-throughput slicing workhorse<\/h2>\n      <p>Same enclosed upright frame as the rotary models \u2014 stripped to a single job: slicing germanium ingots into wafers automatically, hours at a time.<\/p>\n    <\/div>\n    <div class=\"video-wrap\">\n      <figure class=\"shot\">\n        <img fetchpriority=\"high\" decoding=\"async\" src=\"images\/sg40-germanium-wafer-slicing-machine.jpg\" alt=\"germanium wafer slicing machine SG40 front view\" width=\"1100\" height=\"770\" onerror=\"this.style.display=&#039;none&#039;;this.nextElementSibling.classList.add(&#039;show&#039;)\" title=\"Vimfun glass cutting equipment is a perfect machine tool for precision cutting\">\n        <div class=\"ph\">\n          <svg viewBox=\"0 0 460 320\" role=\"img\" aria-label=\"SG40 germanium wafer slicing machine \u2014 enclosed upright frame with observation window and touchscreen\">\n            <rect x=\"0\" y=\"0\" width=\"460\" height=\"320\" fill=\"none\"\/>\n            <!-- base cabinet -->\n            <rect x=\"118\" y=\"252\" width=\"232\" height=\"44\" rx=\"6\" fill=\"#015A93\"\/>\n            <rect x=\"136\" y=\"296\" width=\"26\" height=\"16\" fill=\"#14202C\"\/>\n            <rect x=\"306\" y=\"296\" width=\"26\" height=\"16\" fill=\"#14202C\"\/>\n            <!-- main enclosure -->\n            <rect x=\"110\" y=\"42\" width=\"248\" height=\"214\" rx=\"12\" fill=\"#fff\" stroke=\"#015A93\" stroke-width=\"2.2\"\/>\n            <!-- observation window -->\n            <rect x=\"134\" y=\"70\" width=\"150\" height=\"150\" rx=\"8\" fill=\"#D5E8F6\" stroke=\"#0274BE\" stroke-width=\"1.6\"\/>\n            <!-- 3 guide wheels inside window (vertical layout for slicing) -->\n            <circle cx=\"160\" cy=\"98\" r=\"14\" fill=\"#fff\" stroke=\"#015A93\" stroke-width=\"1.6\"\/>\n            <circle cx=\"258\" cy=\"98\" r=\"14\" fill=\"#fff\" stroke=\"#015A93\" stroke-width=\"1.6\"\/>\n            <circle cx=\"209\" cy=\"200\" r=\"11\" fill=\"#fff\" stroke=\"#015A93\" stroke-width=\"1.6\"\/>\n            <!-- wire loop path -->\n            <path d=\"M160 112 L209 189 M258 112 L209 189 M160 84 Q209 66 258 84\" fill=\"none\" stroke=\"#0274BE\" stroke-width=\"1.8\"\/>\n            <!-- workpiece (vertical ingot side view inside window) -->\n            <rect x=\"199\" y=\"125\" width=\"20\" height=\"60\" fill=\"rgba(2,116,190,.20)\" stroke=\"#015A93\" stroke-width=\"1.4\"\/>\n            <!-- control panel -->\n            <rect x=\"300\" y=\"92\" width=\"44\" height=\"64\" rx=\"5\" fill=\"#14202C\"\/>\n            <rect x=\"306\" y=\"100\" width=\"32\" height=\"34\" rx=\"2\" fill=\"#0274BE\"\/>\n            <line x1=\"306\" y1=\"142\" x2=\"338\" y2=\"142\" stroke=\"#2685C8\" stroke-width=\"2\"\/>\n            <line x1=\"306\" y1=\"148\" x2=\"326\" y2=\"148\" stroke=\"#2685C8\" stroke-width=\"2\"\/>\n            <!-- labels -->\n            <text x=\"134\" y=\"244\" font-family=\"Sora,sans-serif\" font-weight=\"800\" font-size=\"15\" fill=\"#015A93\">SG40<\/text>\n            <text x=\"246\" y=\"244\" font-family=\"IBM Plex Mono\" font-size=\"10\" fill=\"#4E5C72\">ENDLESS WIRE<\/text>\n          <\/svg>\n          <div style=\"font-family:var(--mono);font-size:10.5px;color:var(--ink-soft);padding:9px 14px;background:var(--white);border-top:1px solid var(--line)\">[ Illustration placeholder \u2014 upload images\/sg40-germanium-wafer-slicing-machine.jpg on deploy ]<\/div>\n        <\/div>\n        <figcaption>SG40 \u2014 enclosed upright frame, three-wheel guide system, side-mounted touchscreen.<\/figcaption>\n      <\/figure>\n      <div>\n        <p>The SG40 germanium wafer slicing machine ships as a fully enclosed upright unit on the same proven endless-wire frame as the rotary SGR series \u2014 with the rotary axis stripped out. The cabinet contains coolant mist and swarf, the observation window lets the operator watch a long automatic run, and a three-wheel guide system gives a longer wire path for stable slicing on tall ingots.<\/p>\n        <ul class=\"build-list\">\n          <li><b>Footprint<\/b>&nbsp; ~1066 \u00d7 1066 mm \u00b7 height ~1970 mm<\/li>\n          <li><b>Weight<\/b>&nbsp; ~650 kg \u2014 rigid frame for repeatable wafer thickness<\/li>\n          <li><b>Interface<\/b>&nbsp; side touchscreen + handheld controller (English PLC)<\/li>\n          <li><b>Cooling<\/b>&nbsp; water tank + circulation<\/li>\n          <li><b>Power<\/b>&nbsp; 220 V three-phase \u00b7 1.5 kW \u00b7 60 Hz<\/li>\n        <\/ul>\n        <a class=\"btn btn-ghost\" href=\"#quote\">Request the full spec sheet<\/a>\n      <\/div>\n    <\/div>\n  <\/div>\n<\/section>\n\n<!-- KEY FEATURES -->\n<section class=\"band\">\n  <div class=\"wrap\">\n    <div class=\"sec-head\">\n      <div class=\"eyebrow\">Key Features<\/div>\n      <h2>What the SG40 germanium wafer slicing machine does<\/h2>\n      <p>One job, done well. Automatic slicing of germanium cylinders into wafers at production volume \u2014 without the price tag of features you don't need.<\/p>\n    <\/div>\n    <div class=\"feat-grid\">\n      <div class=\"feat\"><div class=\"num\">1<\/div><h3>Automatic multi-thickness slicing<\/h3><p>Program slice thickness and quantity on the touchscreen \u2014 the machine runs unattended and supports different thicknesses inside one cutting job. Mix 3&nbsp;mm windows and 8&nbsp;mm lens blanks off the same ingot.<\/p><\/div>\n      <div class=\"feat\"><div class=\"num\">2<\/div><h3>~0.5 mm closed-loop kerf<\/h3><p>Same endless-wire kerf as the rotary models. On a $2,200\/kg ingot that's roughly $200\u2013$600 of germanium saved per ingot versus a core drill \u2014 every ingot.<\/p><\/div>\n      <div class=\"feat\"><div class=\"num\">3<\/div><h3>Servo YZ motion, \u00b10.01 mm<\/h3><p>Linear guides and ball screws on both axes give 0.01&nbsp;mm feed resolution and \u00b10.01&nbsp;mm repeatability \u2014 so wafer #1 and wafer #50 come off the same thickness.<\/p><\/div>\n      <div class=\"feat\"><div class=\"num\">4<\/div><h3>400 \u00d7 400 mm worktable<\/h3><p>A bigger table than the rotary SGR40 (\u00d8380). Fits longer ingots and tall stacks, and accepts workpieces up to 400&nbsp;mm in height.<\/p><\/div>\n      <div class=\"feat\"><div class=\"num\">5<\/div><h3>Three-wheel guide system<\/h3><p>Two \u00d8250&nbsp;mm wheels plus one \u00d8180&nbsp;mm, giving a ~2580&nbsp;mm wire path and a stable wire approach geometry for repeatable slices on tall ingots.<\/p><\/div>\n      <div class=\"feat\"><div class=\"num\">6<\/div><h3>Water cooling + circulation<\/h3><p>Built-in water tank with a circulation loop keeps the cut clean and the wire cool \u2014 and keeps coolant consumption predictable across long automatic runs.<\/p><\/div>\n    <\/div>\n  <\/div>\n<\/section>\n\n<!-- VIDEO -->\n<section id=\"video\">\n  <div class=\"wrap\">\n    <div class=\"sec-head\">\n      <div class=\"eyebrow\">Videos<\/div>\n      <h2>See the SG40 endless wire saw in action<\/h2>\n      <p>The germanium wafer slicing machine runs on the same closed-loop endless-wire technology as the rest of the SG family \u2014 set thickness, set count, start the job. Watch the wire, the cooling system, and the wafers come off the ingot in sequence.<\/p>\n    <\/div>\n    <div class=\"vid-2\">\n      <div class=\"vid-item\">\n        <a class=\"video-ph\" href=\"https:\/\/www.youtube.com\/@endlessdiamondwireloop\" target=\"_blank\" rel=\"noopener noreferrer\" aria-label=\"Endless wire working principle video\">\n          <span class=\"play\"><svg viewBox=\"0 0 24 24\"><path d=\"M8 5v14l11-7z\"\/><\/svg><\/span>\n          <span class=\"t\">Working principle \u2014 closed-loop endless wire (paste embed ID on deploy)<\/span>\n        <\/a>\n        <p class=\"cap\">\u25b8 Working principle \u2014 endless diamond wire technology<\/p>\n      <\/div>\n      <div class=\"vid-item\">\n        <a class=\"video-ph\" href=\"https:\/\/www.youtube.com\/@endlessdiamondwireloop\" target=\"_blank\" rel=\"noopener noreferrer\" aria-label=\"SG40 slicing demo video\">\n          <span class=\"play\"><svg viewBox=\"0 0 24 24\"><path d=\"M8 5v14l11-7z\"\/><\/svg><\/span>\n          <span class=\"t\">Slicing demo \u2014 automatic multi-thickness wafer cutting (paste embed ID on deploy)<\/span>\n        <\/a>\n        <p class=\"cap\">\u25b8 Slicing function \u2014 automatic Ge wafer output<\/p>\n      <\/div>\n    <\/div>\n    <p style=\"color:var(--ink-soft);font-size:15px;margin-top:18px\">Don't have an SG40-specific clip yet? We'll send a short slicing reel for your specific ingot diameter when you <a href=\"#quote\">request a sample cut<\/a>.<\/p>\n  <\/div>\n<\/section>\n\n<!-- COST -->\n<section class=\"band\">\n  <div class=\"wrap twocol\">\n    <div class=\"lab\"><div class=\"eyebrow\">The Cost Driver<\/div><h2>Why germanium kerf still matters at slicing volume<\/h2><\/div>\n    <div>\n      <p>A 200&nbsp;mm germanium ingot is worth $6,000 to $10,000 at today's $1,800\u2013$2,400\/kg spot price. Run that ingot through a core drill and you lose 30\u201340% of it to kerf and edge chipping before a single surface is ground. Most buyers compare slicing machines on parts-per-hour. With germanium, that's the wrong starting point \u2014 the material is so expensive that the width of each cut shows up as a line item on your bill of materials.<\/p>\n      <p>Here's the math we run for customers. A core drill removes an entire cylindrical shell on every cut \u2014 typical bit kerf is 5 to 10&nbsp;mm. Push that through a $2,200\/kg ingot and you waste $11\u2013$15 of germanium per cut. An internal-diameter (ID) saw does better on kerf (0.3\u20130.5&nbsp;mm) but leaves a 30\u201380&nbsp;\u00b5m subsurface damage layer the polisher has to grind away later, plus concentric blade marks as the blade wears.<\/p>\n      <p>The SG40 germanium wafer slicing machine runs the same closed-loop endless wire as the rotary models in the family \u2014 unidirectional, kerf near the wire diameter (~0.5&nbsp;mm), no reversing pattern on the cut face. For a shop slicing <span class=\"hl\">50 ingots a month<\/span>, that adds up to <span class=\"hl\">$10,000\u2013$30,000 of germanium kept<\/span>, every month. Same kerf as a rotary machine; lower CapEx because you're not paying for a rotary axis you don't use. For the surface-finish and TTV detail behind every slice, see our <a href=\"https:\/\/www.opticalcutting.com\/germanium-wafer-slicing\/\">germanium wafer slicing<\/a> process page.<\/p>\n    <\/div>\n  <\/div>\n<\/section>\n\n<!-- CAPABILITY DETAIL -->\n<section>\n  <div class=\"wrap twocol\">\n    <div class=\"lab\"><div class=\"eyebrow\">How it cuts<\/div><h2>One job, programmed once<\/h2><\/div>\n    <div>\n      <h3>Mixed thickness in a single run<\/h3>\n      <p>The SG40 controller accepts a list of slice thicknesses inside one cutting job \u2014 for example, three 8&nbsp;mm lens blanks followed by twelve 3&nbsp;mm windows, all off the same germanium ingot. The Y\/Z servos resolve to 0.01&nbsp;mm and repeat to \u00b10.01&nbsp;mm, so the actual slice thickness lands within a few microns of the programmed value across a long run.<\/p>\n      <h3>What \"automatic\" actually means<\/h3>\n      <p>Set the ingot on the worktable, square it to the wire, program the cut list, hit start. The machine handles wire travel, feed rate, and Z-axis indexing between slices. Cut surfaces come off the wire at Ra 0.6\u20131.2&nbsp;\u00b5m with TTV around 8\u201315&nbsp;\u00b5m over a 50&nbsp;mm disc \u2014 clean enough that the grinder can usually skip a rough pass and go straight to face generation.<\/p>\n      <div class=\"note warn\"><div class=\"t\">\u26a0 Setup gotcha<\/div><p>Before a long automatic run, verify the ingot is square to the wire \u2014 a 0.5\u00b0 tilt over a 200&nbsp;mm tall stack gives you a wedge-shaped wafer at the top of the job. We check it with a dial indicator on the wire approach before pressing start. The first wafer off any new ingot is also worth a thickness check; the wire settles into a steady cut after the first slice.<\/p><\/div>\n    <\/div>\n  <\/div>\n<\/section>\n\n<!-- COMPARISON -->\n<section class=\"band\">\n  <div class=\"wrap twocol\">\n    <div class=\"lab\"><div class=\"eyebrow\">Comparison<\/div><h2>How does endless-wire slicing compare to core drilling and ID saws?<\/h2><\/div>\n    <div>\n      <p>Short version: the wire wins on material yield and surface quality. It cuts one wafer at a time, so a multi-wire saw beats it on raw parts-per-hour on flat silicon, but for germanium \u2014 where kerf loss costs more than throughput \u2014 endless wire is the value choice. Here's the honest comparison.<\/p>\n      <table class=\"tbl\">\n        <thead><tr><th>Method<\/th><th>Kerf<\/th><th>Edge chipping<\/th><th>Subsurface<\/th><th>Pcs\/cut<\/th><\/tr><\/thead>\n        <tbody>\n          <tr><td>Core drill<\/td><td>5\u201310 mm<\/td><td>0.3\u20130.8 mm<\/td><td>high<\/td><td>1<\/td><\/tr>\n          <tr><td>ID saw<\/td><td>0.3\u20130.5 mm<\/td><td>moderate<\/td><td>30\u201380 \u00b5m<\/td><td>1<\/td><\/tr>\n          <tr><td class=\"hl\">SG40 closed-loop wire<\/td><td class=\"hl\">~0.5 mm<\/td><td class=\"hl\">&lt; 0.1 mm<\/td><td class=\"hl\">low<\/td><td>1<\/td><\/tr>\n        <\/tbody>\n      <\/table>\n      <p>A 0.1&nbsp;mm edge chip on the wire-cut wafer means the centering machine takes a 0.1&nbsp;mm stock allowance instead of 0.5&nbsp;mm \u2014 less germanium ground off, fewer passes. In our experience that downstream effect is bigger than the cutting-stage saving people focus on first.<\/p>\n      <div class=\"note\"><div class=\"t\">Fair warning on speed<\/div><p>The spec lists max wire speed at 52&nbsp;m\/s, but we run germanium at 30\u201345&nbsp;m\/s, feed 10\u201320&nbsp;mm\/min for slicing. Germanium cleaves on the {111} plane \u2014 it punishes aggressive feeds with cleavage chips at the entry and exit faces. Full material data is in <a href=\"https:\/\/www.crystran.co.uk\/optical-materials\/germanium-ge\" target=\"_blank\" rel=\"noopener noreferrer\">Crystran's germanium datasheet<\/a>.<\/p><\/div>\n    <\/div>\n  <\/div>\n<\/section>\n\n<!-- HIGHLIGHTS -->\n<section>\n  <div class=\"wrap\">\n    <div class=\"sec-head\">\n      <div class=\"eyebrow\">Engineering Highlights<\/div>\n      <h2>Built for volume slicing of brittle optics<\/h2>\n      <p>Why the SG40 germanium wafer slicing machine earns its keep when the same job runs every shift and every wafer has to come off the same.<\/p>\n    <\/div>\n    <div class=\"hl-grid\">\n      <div class=\"hl-card\"><div class=\"ic\"><svg viewBox=\"0 0 24 24\"><path d=\"M12 3v18M5 8l7-5 7 5\"\/><\/svg><\/div><div><div class=\"v\">Up to 52 m\/s wire<\/div><div class=\"d\">High closed-loop linear speed for steady, clean slices.<\/div><\/div><\/div>\n      <div class=\"hl-card\"><div class=\"ic\"><svg viewBox=\"0 0 24 24\"><circle cx=\"12\" cy=\"12\" r=\"8\"\/><path d=\"M12 8v4l3 2\"\/><\/svg><\/div><div><div class=\"v\">\u00b10.01 mm repeatability<\/div><div class=\"d\">Wafer #1 and wafer #50 land at the same thickness.<\/div><\/div><\/div>\n      <div class=\"hl-card\"><div class=\"ic\"><svg viewBox=\"0 0 24 24\"><path d=\"M4 18 L9 7 l3 6 3-9 5 14\"\/><\/svg><\/div><div><div class=\"v\">&lt; 0.1 mm chipping<\/div><div class=\"d\">Low-stress wire cut on germanium edges.<\/div><\/div><\/div>\n      <div class=\"hl-card\"><div class=\"ic\"><svg viewBox=\"0 0 24 24\"><path d=\"M3 7h18M3 12h18M3 17h18\"\/><\/svg><\/div><div><div class=\"v\">Multi-material<\/div><div class=\"d\">Ge, ZnSe, ZnS, silicon, sapphire, optical glass.<\/div><\/div><\/div>\n      <div class=\"hl-card\"><div class=\"ic\"><svg viewBox=\"0 0 24 24\"><path d=\"M5 12l5 5 9-11\"\/><\/svg><\/div><div><div class=\"v\">Free sample cut<\/div><div class=\"d\">Send your ingot and slicing spec; we cut a proof.<\/div><\/div><\/div>\n      <div class=\"hl-card\"><div class=\"ic\"><svg viewBox=\"0 0 24 24\"><path d=\"M12 3l8 4v6c0 4-3 7-8 8-5-1-8-4-8-8V7z\"\/><\/svg><\/div><div><div class=\"v\">1-year warranty<\/div><div class=\"d\">Plus remote support and user-replaceable wire.<\/div><\/div><\/div>\n    <\/div>\n  <\/div>\n<\/section>\n\n<!-- SPECS -->\n<section class=\"band\">\n  <div class=\"wrap twocol\">\n    <div class=\"lab\"><div class=\"eyebrow\">Datasheet<\/div><h2>SG40 technical specifications<\/h2><\/div>\n    <div>\n      <p>Standard-configuration numbers for the SG40 germanium wafer slicing machine. Worktable and travel can be customized for larger ingots.<\/p>\n      <table class=\"tbl datasheet\"><tbody>\n        <tr><td>Worktable size<\/td><td>400 \u00d7 400 mm<\/td><\/tr>\n        <tr><td>Max workpiece height<\/td><td>400 mm<\/td><\/tr>\n        <tr><td>Y \/ Z axis travel<\/td><td>400 mm \/ 400 mm<\/td><\/tr>\n        <tr><td>Diamond wire diameter<\/td><td>0.35\u20131.0 mm<\/td><\/tr>\n        <tr><td>Max wire linear speed<\/td><td>52 m\/s<\/td><\/tr>\n        <tr><td>Y \/ Z minimum feed<\/td><td>0.01 mm<\/td><\/tr>\n        <tr><td>Y \/ Z repeatability<\/td><td>\u00b10.01 mm<\/td><\/tr>\n        <tr><td>Cutting \/ manual speed<\/td><td>0\u20131000 mm\/min (adjustable)<\/td><\/tr>\n        <tr><td>Guide wheels<\/td><td>2 \u00d7 \u00d8250 mm + 1 \u00d7 \u00d8180 mm (3-wheel path)<\/td><\/tr>\n        <tr><td>Diamond wire length<\/td><td>~2580 mm (endless loop)<\/td><\/tr>\n        <tr><td>Drive motor power<\/td><td>1.5 kW (max 4500 RPM)<\/td><\/tr>\n        <tr><td>Power supply<\/td><td>220 V three-phase \u00b7 60 Hz<\/td><\/tr>\n        <tr><td>Dimensions (L\u00d7W\u00d7H)<\/td><td>~1066 \u00d7 1066 \u00d7 1970 mm<\/td><\/tr>\n        <tr><td>Weight<\/td><td>~650 kg<\/td><\/tr>\n        <tr><td>Cooling<\/td><td>Water tank + circulation<\/td><\/tr>\n      <\/tbody><\/table>\n      <p>Read wafer-thickness tolerances against your finished-lens drawing per <a href=\"https:\/\/www.iso.org\/standard\/79655.html\" target=\"_blank\" rel=\"noopener noreferrer\">ISO 10110<\/a> \u2014 the centering and grinding stages inherit whatever the cut leaves them.<\/p>\n      <figure class=\"photo\">\n        <img decoding=\"async\" src=\"images\/germanium-wafer-slicing-machine-sg40-spec.jpg\" alt=\"SG40 germanium wafer slicing machine interior with three-wheel guide system\" width=\"1200\" height=\"600\" onerror=\"this.style.display=&#039;none&#039;;this.parentNode.querySelector(&#039;figcaption&#039;).textContent=&#039;[ Product photo placeholder \u2014 upload images\/germanium-wafer-slicing-machine-sg40-spec.jpg on deploy; alt text already set. ]&#039;;\" title=\"Vimfun glass cutting equipment is a perfect machine tool for precision cutting\">\n        <figcaption>SG40 germanium wafer slicing machine \u2014 three-wheel guide system inside the enclosure.<\/figcaption>\n      <\/figure>\n    <\/div>\n  <\/div>\n<\/section>\n\n<!-- MATERIALS -->\n<section>\n  <div class=\"wrap twocol\">\n    <div class=\"lab\"><div class=\"eyebrow\">Materials<\/div><h2>Which brittle IR materials can it cut?<\/h2><\/div>\n    <div>\n      <p>The wire cuts anything softer than diamond, so the SG40 isn't germanium-only. We slice the following on the same platform, each with its own parameter set:<\/p>\n      <ul class=\"clean\">\n        <li><strong>Germanium (Ge)<\/strong> \u2014 0.35\u20130.5 mm wire, 100\u2013140 N tension, white mineral oil<\/li>\n        <li><strong>Silicon (Si)<\/strong> \u2014 mature, 0.42\u20130.5 mm wire<\/li>\n        <li><strong>Zinc selenide (ZnSe)<\/strong> &amp; <strong>zinc sulfide (ZnS)<\/strong> \u2014 CO\u2082 laser and multispectral optics<\/li>\n        <li><strong>Sapphire<\/strong> \u2014 0.5\u20130.65 mm wire<\/li>\n        <li><strong>Optical glass (BK7 \/ K9)<\/strong> &amp; <strong>fused quartz<\/strong><\/li>\n      <\/ul>\n      <p>Cutting something not on the list \u2014 chalcogenide glass, a specialty ceramic? Send a sample and we'll test-cut it before quoting parameters. We don't guess on materials we haven't run.<\/p>\n    <\/div>\n  <\/div>\n<\/section>\n\n<!-- PRODUCTION LINE -->\n<section class=\"band\">\n  <div class=\"wrap twocol\">\n    <div class=\"lab\"><div class=\"eyebrow\">Production line<\/div><h2>Where it fits in a germanium lens line<\/h2><\/div>\n    <div>\n      <p>The SG40 germanium wafer slicing machine is the volume front end. It turns ingots into wafers; everything after \u2014 edge centering, spherical grinding, polishing, AR coating \u2014 works from the wafer it produces. Because the wire leaves a consistent TTV and a low-damage surface, the downstream fixtures set up against known inputs instead of re-tuning every batch.<\/p>\n      <p>Building the whole chain rather than just the slicing station? The <a href=\"https:\/\/www.opticalcutting.com\/germanium-lens-manufacturing\/\">germanium lens manufacturing<\/a> solution page lays out the five-stage workflow and how the tolerance budget flows station to station. For the broader equipment range, start at the <a href=\"https:\/\/www.opticalcutting.com\/\">infrared optics manufacturing equipment<\/a> hub.<\/p>\n      <div class=\"note\"><div class=\"t\">When to pick a different machine<\/div><p>If your job mixes round wafers with prism, square, or polygonal blanks, the <a href=\"https:\/\/www.opticalcutting.com\/germanium-lens-blank-cutting-machine\/\">SGR40 germanium lens blank cutting machine<\/a> adds a rotary axis \u2014 same closed-loop wire, same kerf, but with multi-shape capability. And if you need free-form CAD contour cuts (crescents, arbitrary curves), that's the SGI contour series, not this one.<\/p><\/div>\n    <\/div>\n  <\/div>\n<\/section>\n\n<!-- CTA -->\n<section class=\"cta\" id=\"quote\">\n  <div class=\"wrap cta-inner\">\n    <div>\n      <div class=\"eyebrow\">Next step<\/div>\n      <h2>Get a sample cut on your own germanium<\/h2>\n      <p>Pick the SG40 germanium wafer slicing machine if you're cutting germanium ingots into round wafers in volume and want the leanest setup that still keeps wide kerf off your BOM. Send us your ingot diameter and length, target wafer thicknesses and counts, and monthly volume \u2014 we'll run a free test slice on your own germanium before you commit.<\/p>\n    <\/div>\n    <div>\n      <a class=\"btn\" href=\"mailto:daria@endlesswiresaw.com?subject=SG40%20germanium%20wafer%20slicing%20machine%20\u2014%20sample%20cut%20request\"><svg viewBox=\"0 0 24 24\" fill=\"none\" stroke=\"currentColor\" stroke-width=\"2.2\"><path d=\"M5 12h14M13 6l6 6-6 6\"\/><\/svg>Request a sample slice &amp; quote<\/a>\n      <p class=\"trust\"><b>Vimfun<\/b> \u00b7 ISO 9001 \u00b7 CE compliant \u00b7 shipped to 20+ countries<br>\n      Optics customers include Edmund Optics and Coherent.<br>\n      Tel +1 (408) 571-8651 \u00b7 <a href=\"mailto:daria@endlesswiresaw.com\">daria@endlesswiresaw.com<\/a><\/p>\n    <\/div>\n  <\/div>\n<\/section>\n\n<!--\nSEO SETTINGS (Rank Math)\nSEO Title: Germanium Wafer Slicing Machine: Multi-Thickness, 0.5 mm Kerf\nMeta Description: The SG40 germanium wafer slicing machine cuts Ge ingots into wafers at ~0.5 mm kerf, with mixed thicknesses in one automatic job. 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